Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

This study describes a thermal design method of forced convection cooling in high-density packaging electronic equipment for upstream design processes by flow and thermal resistance network analysis. Forced convection cooling by combining fans and heat sinks is the most standard strategy for dissipating heat from electronic equipment. In recent years, the thermal design of electronic equipment becomes more critical, and fast thermal design is required due to the rapid development of final products. We have been developing the flow and thermal resistance network analysis as the quick thermal design method for electronic equipment. However, an accurate prediction of forced convection cooling performance by finned heat sinks mounted in high-density packaging electronic equipment is generally tricky. Some bypasses, which are clearances between the heat sinks and enclosure walls or other components, exist around the heat sinks. Therefore, a flow rate distribution between the heat sink fins and the bypasses should be predicted. Many researchers have investigated hydrodynamic characteristics and heat transfer characteristics of finned heat sinks. However, many previous studies have been conducted on the finned heat sink performance when there are no bypasses. In order to achieve an optimum design of the finned heat sinks in the upstream configuration regardless of the heat sink dimensions, a systematic database of hydrodynamic characteristics and heat transfer characteristics of the finned heat sinks with bypasses should be investigated. This paper discusses the development of function models of pressure drop, flow rate distribution, and heat transfer of the finned heat sinks with the bypasses for the resistance network analysis through experiments and CFD analysis. Several types of finned heat sinks with 40 mm in width and 80 mm in length were prepared, and these were mounted in a rectangular enclosure with 45 mm in width and height. First, the pressure drop characteristic around the heat sink was investigated. In addition, the flow rate distribution between the heat sink and the bypass was evaluated separately. A flow branching coefficient was developed to predict the flow rate distribution around the heat sink combined with the pressure drop coefficient. Using the developed flow branching coefficient, the flow and thermal resistance network model around the finned heat sink was developed. The results from the proposed resistance network model showed good agreement with those from the experiment.

Multistage Digital-to-Analogue Chip Based on a Weighted Flow Resistance Network for Soft Actuators

A control chip with a multistage flow-rate regulation function based on the correlation between the flow resistance and flow rate has been developed in this article. Compared with the traditional proportional solenoid valve, this kind of flow valve based on microfluidic technology has the characteristics of being light-weight and having no electric drive. It solves such technical problems as how the current digital microfluidic chip can only adjust the flow switch, and the adjustment of the flow rate is difficult. To linearize the output signal, we propose a design method of weighted resistance. The output flow is controlled by a 4-bit binary pressure signal. According to the binary value of the 4-bit pressure signal at the input, the output can achieve 16-stage flow adjustment. Furthermore, we integrate the three-dimensional flow resistance network, multilayer structure microvalve, and parallel fluid network into a single chip by using 3D printing to obtain a modular flow control unit. This structure enables the microflow control signal to be converted from a digital signal to an analogue signal (DA conversion), and is suitable for microflow driving components, such as in microfluidic chip sampling systems and proportional mixing systems. In the future, we expect this device to even be used in the automatic control system of a miniature pneumatic soft actuator.

Světlana: Partisans and Power in Post-War Czechoslovakia

After the renewal of national independence in 1945 former anti-fascist partisans were among the Czechoslovak Communist Party's most reliable and radical allies. Nevertheless, following the communist coup of 1948, a group of partisans in the rural region of Moravian Wallachia began to mobilise wartime networks and tactics against the consolidating party dictatorship, establishing the Světlana resistance network. Simultaneously, state authorities also drew on partisan practices to reconstitute opposition and resistance in this region as evidence of an international conspiracy that could be understood and prosecuted within the framework of official ideology and propaganda. This article analyses the case of Světlana to examine the politics of people's democracy in Czechoslovakia and explore local dynamics of resistance and repression during the early years of the communist regime.