Mie-driven directional nanocoupler for Bloch surface wave photonic platform

Modern integrated photonic platforms should combine low-loss guiding, spectral flexibility, high light confinement, and close packing of optical components. One of the prominent platforms represents a one-dimensional photonic crystal combined with dielectric nanostructures that manipulate low-loss Bloch surface waves (BSWs). Proper design of nanostructures gives rise to a variety of optical resonances suitable for efficient capturing and controlling light. In this work, we achieve color-selective directional excitation of BSWs mediated by Mie resonances in a semiconductor nanoparticle. We show that a single silicon nanoparticle can be used as a subwavelength multiplexer switching the BSW excitation direction from forward to backward within the 30 nm spectral range with its central wavelength governed by the nanoparticle size. Our work opens a route for the on-demand fabrication of photonic nanocouplers with tailored optical properties and submicron footprint.

Electronic Multiscale Hybrid Materials: Sinter-Free Inks, Printed Transparent Grids, and Soft Devices

Hybrid electronic materials combine the excellent electronic properties of metals and semiconductors with the mechanical flexibility, ease of processing, and optical transparency of polymers. This talk will discuss hybrids that combine organic and inorganic components at different scales. Metallic and semiconductor nanoparticle cores are coated with conductive polymer shells to create “hybrid inks” that can be inkjet-printed and form conductive leads without any sintering step. Transparent electrodes are printed using ultrathin metal nanowires with core diameters below 2 nm. The chemically synthesized wires spontaneously form percolating structures when patterned with a soft stamp; this rapidly yields optically transparent grid electrodes, even on demanding soft substrates. These new hybrid electronic materials enable the fabrication of soft electronics, including flexible sensors on polymer foils, radio-frequency identification (RFID) antennae on cardboard, and soft human–machine interfaces. Selected devices will be covered at the end of the talk.

A universal method for depositing patterned materials in situ

Current techniques of patterned material deposition require separate steps for patterning and material deposition. The complexity and harsh working conditions post serious limitations for fabrication. Here, we introduce a single-step and easy-to-adapt method that can deposit materials in-situ. Its methodology is based on the semiconductor nanoparticle assisted photon-induced chemical reduction and optical trapping. This universal mechanism can be used for depositing a large selection of materials including metals, insulators and magnets, with quality on par with current technologies. Patterning with several materials together with optical-diffraction-limited resolution and accuracy can be achieved from macroscopic to microscopic scale. Furthermore, the setup is naturally compatible with optical microscopy based measurements, thus sample characterisation and material deposition can be realised in-situ. Various devices fabricated with this method in 2D or 3D show it is ready for deployment in practical applications. This method will provide a distinct tool in material technology.