Evaluation of Fatigue Crack Growth in Solder Layer of IGBT Module under Power Cycle by Using J-integral Method
Keyword(s):
Keyword(s):
1990 ◽
Vol 56
(524)
◽
pp. 723-730
Keyword(s):
Keyword(s):
2009 ◽
Vol 40
(10)
◽
pp. 743-749
◽
Keyword(s):
2019 ◽
Vol 99
◽
pp. 263-272
◽
Keyword(s):
1989 ◽
Vol 32
(2)
◽
pp. 237-244
◽
Keyword(s):
2006 ◽
Vol 27
(2)
◽
pp. 149-160
◽
Keyword(s):
1988 ◽
Vol 30
(2)
◽
pp. 119-133
◽
2019 ◽
Vol 216
◽
pp. 106470
◽
1979 ◽
Vol 101
(3)
◽
pp. 224-230
◽
Keyword(s):