Research on high-temperature oxidation resistance, hot forming ability, and microstructure of Al–Si–Cu coating for 22MnB5 steel

High-temperature oxidation resistance, hot formability, element distribution, and microstructure of Al-10% Si-(0.5–3.0%)Cu coating were investigated by means of glow discharge spectroscopy, optical microscope, scanning electron microscope, and energy-dispersive spectroscopy. Results show that the addition of Cu can increase high-temperature oxidation resistance above 950°C and improve hot formability so that no crack spreads into substrate steel as hot forming at 33.3% strain. Oxidation film structure is continual and compacting, and Si highly concentrates in the surface layer. The distribution of Cu has skin effect with peaking content 8.2% in the surface layer. After hot stamping, Al and Si diffuse into substrate steel, and Cu diffuses from inner to outer coating. Al–Si–Cu coating has smoother surface, straighter diffusion layer, and finer metal compound than Al–Si coating. Surface and diffusion layers are identified as aluminum oxide, Si-rich, and Cu phase and Al7SiFe2, Al3Fe, and CuAl3, respectively. Al-rich phase and the metal compound are composed of α-Al dissolving Fe, Si, and Cu and Al–Si matrix, Cu3Al, respectively.

Hole-rich CoP nanosheets with an optimized d-band center for enhancing pH-universal hydrogen evolution electrocatalysis

The creation of holes on the surface of CoP can optimize the d-band center of CoP for enhancing the HER activity. And this method can direct us to design more transition metal compound-based hole-rich catalysts.