Pin Fin Heat Sink Optimization for Natural-Convection Cooling

Author(s):  
Wessel W. Wits ◽  
Yannick Jeggels ◽  
Norbert Engelberts
Energies ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 4046
Author(s):  
Ram Adhikari ◽  
Dawood Beyragh ◽  
Majid Pahlevani ◽  
David Wood

Light-emitting diode (LED) grow lights are increasingly used in large-scale indoor farming to provide controlled light intensity and spectrum to maximize photosynthesis at various growth stages of plants. As well as converting electricity into light, the LED chips generate heat, so the boards must be properly cooled to maintain the high efficiency and reliability of the LED chips. Currently, LED grow lights are cooled by forced convection air cooling, the fans of which are often the points of failure and also consumers of a significant amount of power. Natural convection cooling is promising as it does not require any moving parts, but one major design challenge is to improve its relatively low heat transfer rate. This paper presents a novel heat sink design for natural convection cooling of LED grow lights. The new design consists of a large rectangular fin array with openings in the base transverse to the fins to increase air flow, and hence the heat transfer. Numerical simulations and experimental testing of a prototype LED grow light with the new heat sink showed that openings achieved their intended purpose. It was found that the new heat sink can transfer the necessary heat flux within the safe operating temperature range of LED chips, which is adequate for cooling LED grow lights.


Author(s):  
Koji Shimoyama ◽  
Atsuki Komiya

AbstractAdditive manufacturing (AM) has an affinity with topology optimization to think of various designs with complex structures. Hence, this paper aims to optimize the design of a lattice-structured heat sink, which can be manufactured by AM. The design objectives are to maximize the thermal performance of convective heat transfer in natural convection simulated by computational fluid dynamics (CFD) and to minimize the material cost required for AM process at the same time. The lattice structure is represented as a node/edge system via graph theory with a moderate number of design variables. Bayesian optimization, which employs the non-dominated sorting genetic algorithm II and the Kriging surrogate model, is conducted to search for better designs with the minimum CFD cost. The present topology optimization successfully finds better lattice-structured heat sink designs than a reference fin-structured design regarding thermal performance and material cost. Also, several optimized lattice-structured designs outperform reference pin-fin-structured designs regarding thermal performance though the pin-fin structure is still advantageous for a material cost-oriented design. This paper also discusses the flow mechanism observed in the heat sink to explain how the optimized heat sink structure satisfies the competing design objectives simultaneously.


2014 ◽  
Vol 695 ◽  
pp. 398-402
Author(s):  
Yap Zi Qin ◽  
Amer Nordin Darus ◽  
Nor Azwadi Che Sidik

As technology advancement progressed in this information age or commonly known as digital age, thermal management has equally improved to keep up with demands from the electronic sector. Hence, heat sink study has become more and more prominent. Natural convection holds advantages since it is maintenance free and has zero power consumption. The purpose of this research is to study the heat transfer performance of heat sink with parametric variations of number and height of pin fin at temperature 308K, 323K, 338K, 353K and 368K. In addition, effect of porosity ranges from 0.524 to 0.960 on thermal resistance was investigated as well. Study found that heat transfer coefficient increases as temperature difference between heat sink and ambient increases. Thermal resistance decreases when porosity increases until it reaches the minimum and subsequently increases. The optimum porosity shown in this study is around 88%.


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