IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585)
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76

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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Using a digital channel of a test system as an analog reference for wireless SOC testing

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321660 ◽

2005 ◽

Author(s):

R. McAleenan ◽

J. Kelly

Keyword(s):

Test System ◽

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Collaboration through industry standards for manufacturing success

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321673 ◽

2004 ◽

Author(s):

D. Dowding ◽

A. Hildebrant ◽

D. Chindamo ◽

J. Rearick

Keyword(s):

Industry Standards

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Correlation between power cycling and thermal cycling fatigue reliabilities of chip-scale packages

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321627 ◽

2004 ◽

Author(s):

Tong Hong Wang ◽

Chang Chi Lee ◽

Yi-Shao Lai ◽

Chun-En Huang

Keyword(s):

Thermal Cycling ◽

Power Cycling ◽

Thermal Cycling Fatigue

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Peculiarities of measuring the alpha particle activity of flat samples of metals, alloys and powders using gas flow proportional counters specifically the model 1950 manufactured by "Spectrum Sciences", USA

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321650 ◽

2004 ◽

Author(s):

S.M. Zakharyasah ◽

Y.B. Tolstukhin ◽

I.V. Fedotova

Keyword(s):

Alpha Particle ◽

Gas Flow ◽

Proportional Counters

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Experimental wetting dynamics study of eutectic and lead-free solders varying flux, temperature and surface finish metallization

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321632 ◽

2004 ◽

Author(s):

Suk Chae Kang ◽

Chunho Kim ◽

J. Muncy ◽

M. Schmidt ◽

D. Baldwin

Keyword(s):

Surface Finish ◽

Lead Free ◽

Lead Free Solders ◽

Wetting Dynamics

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The development of a novel stacked package: package in package

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321638 ◽

2004 ◽

Author(s):

F. Carson ◽

Young-Cheol Kim

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New challenges in the rework of 0201 passives

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321681 ◽

2004 ◽

Author(s):

N. O'Brien

Keyword(s):

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Development of high power QFN package

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321678 ◽

2004 ◽

Author(s):

F. Poh KS ◽

Tan Hien Boon ◽

Krishnamoorthi Sivalingam ◽

Lim Beng Kuan ◽

A.Y.S. Sun ◽

...

Keyword(s):

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PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321630 ◽

2004 ◽

Author(s):

J.-D. Kim ◽

W.-S. Choi ◽

K.-S. Park ◽

E.-H. Kim ◽

S.-B. Lee ◽

...

Keyword(s):

Free Movement ◽

Lead Free ◽

Electro Deposition ◽

Frame Technology ◽

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Guidelines for improving intermetallic reliability

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) ◽

10.1109/iemt.2004.1321655 ◽

2004 ◽

Author(s):

L. Levine ◽

M. Osborne ◽

F. Keller

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