2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Latest Publications

TOTAL DOCUMENTS

149

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9784904090138

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A low temperature Cu-Cu direct bonding method with VUV and HCOOH treatment for 3D integration

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111059 ◽

2015 ◽

Cited By ~ 3

Author(s):

Taiji Sakai ◽

Nobuhiro Imaizumi ◽

Seiki Sakuyama

Keyword(s):

Low Temperature ◽

3D Integration ◽

Bonding Method

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Development of mountable pulse-type hardware neuron model integrated circuit on MEMS microrobot

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111047 ◽

2015 ◽

Author(s):

M. Takato ◽

Y. Naito ◽

K. Maezumi ◽

Y. Ishihara ◽

Y. Okane ◽

...

Keyword(s):

Integrated Circuit ◽

Neuron Model ◽

Pulse Type

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Novel impedance controllable testing socket for high speed/frequency package

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111140 ◽

2015 ◽

Author(s):

Kuan-Yi Cheng ◽

Sung-Mao Wu ◽

Lung-Shu Huang ◽

Chen-Chang Cheng ◽

Yen-Tang Chang

Keyword(s):

High Speed

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Effect of silver content and vacuum reflow soldering on thermal fatigue life of Sn-Ag-Cu solder

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111083 ◽

2015 ◽

Author(s):

Mitsuharu Yamabe

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Silver Content ◽

Reflow Soldering ◽

Thermal Fatigue Life

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Development of nanocavity sealing process for MEMS optical interferometric biosensor

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111011 ◽

2015 ◽

Cited By ~ 1

Author(s):

Kazuhiro Takahashi ◽

Yoshihiro Masuya ◽

Ryo Ozawa ◽

Makoto Ishida ◽

Kazuaki Sawada

Keyword(s):

Interferometric Biosensor

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Advanced plating photoresist development for semiconductor packages

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111090 ◽

2015 ◽

Cited By ~ 2

Author(s):

Hirokazu Sakakibara ◽

Hisanori Akimaru ◽

Akito Hiro ◽

Keiichi Sato ◽

Koichi Fujiwara ◽

...

Keyword(s):

Semiconductor Packages

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Influence of air exposure time on bonding strength in Au-Au surface activated wafer bonding

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111055 ◽

2015 ◽

Cited By ~ 2

Author(s):

Ken Okumura ◽

Eiji Higurashi ◽

Tadatomo Suga ◽

Kei Hagiwara

Keyword(s):

Exposure Time ◽

Wafer Bonding ◽

Bonding Strength ◽

Air Exposure

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A novel MEMS-based lab-on-a-tube technology and its application

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111137 ◽

2015 ◽

Author(s):

Yi Zhang ◽

Toshihiro Itoh ◽

Ryutaro Maeda

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CSP LED validation through optical simulations for high irradiance UV LED module

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111133 ◽

2015 ◽

Cited By ~ 1

Author(s):

Hao-Xiang Lin ◽

Chin-Chang Hsu ◽

Cheng-Chun Liao ◽

Chung-Min Chang ◽

Chih-Peng Hsu

Keyword(s):

High Irradiance ◽

Uv Led

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Evaluation of through-silicon-via process using scanning laser beam induced current (SLBIC) system

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111024 ◽

2015 ◽

Author(s):

Woon Choi ◽

Takahiro Ishimoto ◽

Hajime Tomokage

Keyword(s):

Laser Beam ◽

Scanning Laser ◽

Induced Current ◽

Through Silicon Via

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2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A low temperature Cu-Cu direct bonding method with VUV and HCOOH treatment for 3D integration

Development of mountable pulse-type hardware neuron model integrated circuit on MEMS microrobot

Novel impedance controllable testing socket for high speed/frequency package

Effect of silver content and vacuum reflow soldering on thermal fatigue life of Sn-Ag-Cu solder

Development of nanocavity sealing process for MEMS optical interferometric biosensor

Advanced plating photoresist development for semiconductor packages

Influence of air exposure time on bonding strength in Au-Au surface activated wafer bonding

A novel MEMS-based lab-on-a-tube technology and its application

CSP LED validation through optical simulations for high irradiance UV LED module

Evaluation of through-silicon-via process using scanning laser beam induced current (SLBIC) system

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Latest Publications