Thermal Stress and Strain in Microelectronics Packaging
Latest Publications

TOTAL DOCUMENTS

23

(FIVE YEARS 0)

H-INDEX

6

(FIVE YEARS 0)

Published By Springer US

9781468477696, 9781468477672

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal Stress Considerations in Die-Attachment

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_6 ◽

1993 ◽

pp. 194-220 ◽

Author(s):

Goran S. Matijasevic ◽

Chen Yu Wang ◽

Chin C. Lee

Keyword(s):

Thermal Stress ◽

Download Full-text

Correlation of Analytical and Experimental Approaches to Determination of Thermally Induced Printed Wiring Board (PWB) Warpage

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_9 ◽

1993 ◽

pp. 305-328 ◽

Author(s):

C.-P. Yeh ◽

C. Ume ◽

R. E. Fulton ◽

K. W. Wyatt ◽

J. W. Stafford

Keyword(s):

Printed Wiring Board ◽

Thermally Induced ◽

Experimental Approaches ◽

Download Full-text

Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_8 ◽

1993 ◽

pp. 272-304 ◽

Author(s):

Arkady Voloshin

Keyword(s):

Thermal Loading ◽

Moiré Interferometry ◽

Moire Interferometry ◽

Electronics Packages

Download Full-text

Die Stress Measurement Using Piezoresistive Stress Sensors

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_7 ◽

1993 ◽

pp. 221-271 ◽

Author(s):

James N. Sweet

Keyword(s):

Stress Measurement ◽

Stress Sensors ◽

Download Full-text

Transient Thermal Stresses in Multilayered Devices

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_4 ◽

1993 ◽

pp. 139-172 ◽

Author(s):

An-Yu Kuo ◽

Kuan-Luen Chen

Keyword(s):

Thermal Stresses ◽

Transient Thermal

Download Full-text

Thermal Stress Issues in Plated-Through-Hole Reliability

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_20 ◽

1993 ◽

pp. 648-683 ◽

Author(s):

Donald B. Barker ◽

Abhijit Dasgupta

Keyword(s):

Thermal Stress ◽

Plated Through Hole ◽

Download Full-text

Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_12 ◽

1993 ◽

pp. 385-409 ◽

Author(s):

E. Suhir

Keyword(s):

Integrated Circuit ◽

Plastic Packages

Download Full-text

Temperature Dependence of Thermal Expansion of Materials for Electronics Packages

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_5 ◽

1993 ◽

pp. 173-193 ◽

Author(s):

R. Chanchani ◽

Peter M. Hall

Keyword(s):

Thermal Expansion ◽

Temperature Dependence ◽

Electronics Packages

Download Full-text

A Prediction of the Thermal Fatigue Life of Solder Joints Using Crack Propagation Rate and Equivalent Strain Range

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_16 ◽

1993 ◽

pp. 500-531 ◽

Author(s):

Ryohei Satoh

Keyword(s):

Fatigue Life ◽

Crack Propagation ◽

Thermal Fatigue ◽

Solder Joints ◽

Strain Range ◽

Crack Propagation Rate ◽

Propagation Rate ◽

Equivalent Strain ◽

Thermal Fatigue Life

Download Full-text

Thermal and Moisture Stresses in Plastic Packages

Thermal Stress and Strain in Microelectronics Packaging ◽

10.1007/978-1-4684-7767-2_13 ◽

1993 ◽

pp. 410-444 ◽

Author(s):

Michel Mermet-Guyennet

Keyword(s):

Plastic Packages

Download Full-text