Thermal Stress Issues in Plated-Through-Hole Reliability

1993 ◽  
pp. 648-683 ◽  
Author(s):  
Donald B. Barker ◽  
Abhijit Dasgupta
Keyword(s):  
Thermal Stress ◽  
Plated Through Hole ◽  
Through Hole

scholarly journals Prediction of Thermal-Cycle Life for Plated Through Hole Based on Thermal-Stress Analysis.

1991 ◽  
Vol 6 (6) ◽  
pp. 306-314 ◽  
Author(s):  
Yoichi KITAMURA ◽  
Takashi TAKAHAMA ◽  
Susumu HOSHINOUCHI
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Thermal Cycle ◽  
Cycle Life ◽  
Thermal Stress Analysis ◽  
Plated Through Hole ◽  
Through Hole

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

1991 ◽  
Vol 113 (2) ◽  
pp. 149-155 ◽  
Author(s):  
D. Barker ◽  
M. Pecht ◽  
A. Dasgupta ◽  
S. Naqvi
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Three Dimensional ◽  
Strain History ◽  
Thermal Stress Analysis ◽  
Soldering Process ◽  
Wave Soldering ◽  
Plated Through Hole ◽  
The Impact ◽  
Through Hole

During a typical wave soldering operation a plated through hole (PTH) is exposed to temperatures which are higher than any rated operating temperatures. Understanding the heat transfer and the potential PTH damage mechanisms, which arise during the wave soldering process, is critical to PTH quality control and reliability. In particular, cracks may be initiated during the wave soldering transient and become manifest only after operational cycling. This paper presents a transient nonlinear thermal stress analysis of a nonsolder filled PTH that is subjected to a typical wave soldering process. A full three-dimensional orthotropic analysis and an axisymmetric analysis with cylindrically anisotropic properties are used and the results compared. Temperature and stress/strain history curves are examined to determine the impact of the wave soldering operation on the PTH fatigue life. The effect of PWB innerplanes on the PTH maximum stress and strain is also investigated.

Failure Localization of Intermittent Short Failures Caused by Vertical Conductive Anodic Filament Formation

2014 ◽  
Author(s):  
Daniel Nuez ◽  
Phoumra Tan
Keyword(s):  
Glass Fibers ◽  
Vertical Plane ◽  
Axis Formation ◽  
Metal Trace ◽  
Conductive Anodic Filament ◽  
Plated Through Hole ◽  
Voltage Gradients ◽  
Ic Package ◽  
Through Hole ◽  
Failure Localization

Abstract Conductive anodic filament (CAF) formation is a mechanism caused by an electrochemical migration of metals from a metal trace in ICs or in PCBs. This is commonly caused by the moisture build-up in the affected metal terminals in an IC package or PC board caused by critical temperature, high humidity and high voltage gradients conditions. This phenomenon is known to have caused catastrophic field failures on various OEMs electronic components in the past [1,7]. Most published articles on CAF described the formation of the filament in a lateral formation through the glass fiber interfaces between two adjacent metal planes [1-6, 8-12]. One common example is the CAF formation seen between PTH (Plated through Hole) in the laminated substrate with two different potentials causing shorts [1-6, 8-12]. In this paper, the Cu filament grows in a vertical fashion (z-axis formation) creating a vertical plane shorts between the upper and lower metal terminals in a laminated IC package substrate. The copper growth migration does not follow the fiber strands laterally or vertically through them. Instead, it grows through the stress created gaps between the impregnated carbon epoxy fillers from the upper metal trace to the lower metal trace with two different potentials, between the glass fibers. This vertical CAF mechanism creates a low resistive short that was sometimes found to be intermittent in nature. This paper presents some successful failure analysis approaches used to isolate and detect the failure locations for this type of failing devices. This paper also exposes the unique physical appearance of the vertical CAF formation.

Thermal Model of Printed Circuit Board Plated-Through Hole under One-Sided Heating Conditions

2021 ◽  
Vol 26 (5) ◽  
pp. 426-431
Author(s):  
V.A. Sergeev ◽  
◽  
A.M. Khodakov ◽  
M.Yu. Salnikov ◽  
◽  
...  
Keyword(s):  
Quality Control ◽  
Thermal Resistance ◽  
Thermal Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Thermal Models ◽  
Printed Circuit ◽  
Plated Through Hole ◽  
Through Hole

Thermal methods of quality control of the plated-through hole (PTH) of printed circuit board (PCB) are based on thermal models. However, known thermal models of PTH take no account of heat transfer to PCB material thus not allowing for PTH heat characteristic tying up with adhesion quality. In this work, an axisymmetric thermal model of a single-layer PCB PTH under one-sided heating conditions is considered. It was shown that the ratio of the temperature increments of the upper (heated) and lower end of the PTH in the considered range of heating power does not depend on the power level. A linear thermal equivalent scheme of the PTH has been proposed, which includes the longitudinal thermal resistance of the PTH metallization, de-termined by the parameters and quality of the metallization layer, the thermal resistance, which determines the convection heat exchange between the ends of the PTH with the adjacent PCB surface and the environment, and the thermal resistance of the area of the PCB material adjacent to the PTH, depending on the quality of the metallization adhesion and the PCB dielectric. Thermal equivalent circuit parameters determined by the ratio of the temperature increment of the upper and lower ends of the PTH and their difference can serve as the basis for the development of a nondestructive inspection procedure for PTH quality control by way of its unilateral heating, for example, by a laser beam.

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