Integrated Circuit Packaging, Assembly and Interconnections
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Published By Springer US

9780387281537

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Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_15 ◽

2007 ◽

pp. 245-260

Keyword(s):

Organic Packages ◽

Manufacturing Technologies

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Flip Chip—The Bumping Processes

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_10 ◽

2007 ◽

pp. 143-167

Keyword(s):

Flip Chip

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Integrated Circuit Manufacturing: A Technology Resource

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_2 ◽

2007 ◽

pp. 15-29

Keyword(s):

Integrated Circuit ◽

Integrated Circuit Manufacturing

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Electronic Manufacturing and the Integrated Circuit

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_1 ◽

2007 ◽

pp. 1-14

Keyword(s):

Integrated Circuit ◽

Electronic Manufacturing

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Packaging Options—Chip on Board

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_7 ◽

2007 ◽

pp. 93-101

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Known Good Die (KGD)

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_6 ◽

2007 ◽

pp. 81-92

Keyword(s):

Known Good Die

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The Chip Scale Package

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_4 ◽

2007 ◽

pp. 47-59

Keyword(s):

Chip Scale Package

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Packaging the IC—Single Chip Packaging

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_3 ◽

2007 ◽

pp. 31-45

Keyword(s):

Single Chip

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HDI Substrate Manufacturing Technologies: Thick Film Technology

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_13 ◽

2007 ◽

pp. 221-232

Keyword(s):

Thick Film ◽

Manufacturing Technologies ◽

Thick Film Technology

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Flip Chip Assembly

Integrated Circuit Packaging, Assembly and Interconnections ◽

10.1007/0-387-33913-2_11 ◽

2007 ◽

pp. 169-191

Keyword(s):

Flip Chip ◽

Flip Chip Assembly

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Integrated Circuit Packaging, Assembly and InterconnectionsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer US

Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate

Flip Chip—The Bumping Processes

Integrated Circuit Manufacturing: A Technology Resource

Electronic Manufacturing and the Integrated Circuit

Packaging Options—Chip on Board

Known Good Die (KGD)

The Chip Scale Package

Packaging the IC—Single Chip Packaging

HDI Substrate Manufacturing Technologies: Thick Film Technology

Flip Chip Assembly

Integrated Circuit Packaging, Assembly and Interconnections
Latest Publications