2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04
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Philips our experience in the introduction of leadfree soldering

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290859 ◽

2005 ◽

Author(s):

S. Yue

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Philips AVE entertainment policy on sustainability and environmental stewardship

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290856 ◽

2005 ◽

Author(s):

G. Woo

Keyword(s):

Environmental Stewardship

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Quality challenges of reused components

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290906 ◽

2004 ◽

Cited By ~ 1

Author(s):

I. Stobbe ◽

H. Potter ◽

H. Griese ◽

G. Fotheringham ◽

H. Reichl

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Closing the loop of printed-wire-boards and electronic devices: experiences from automatic disassembling as an input for manufacturers

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290898 ◽

2004 ◽

Author(s):

M. Brandstotter ◽

R. Knoth ◽

B. Kopacek ◽

P. Kopacek

Keyword(s):

Electronic Devices ◽

Closing The Loop

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Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290883 ◽

2004 ◽

Author(s):

Jung-Sub Lee ◽

Kun-Mo Chu ◽

Hyo-Hoon Park ◽

Duk Young Jeon

Keyword(s):

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit ◽

Fine Pitch ◽

Solder Bumps ◽

Dry Film ◽

Dry Film Photoresist

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Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processes

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290905 ◽

2004 ◽

Author(s):

A.S.G. Andrae ◽

P. Moller ◽

J. Liu

Keyword(s):

Monte Carlo Simulation ◽

Monte Carlo ◽

Life Cycle ◽

Life Cycle Inventory ◽

Uncertainty Estimation

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Environmental compatibility of electronics - a key towards local and global sustainable development

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290891 ◽

2004 ◽

Cited By ~ 4

Author(s):

H. Griese ◽

L. Stobbe ◽

A. Middendorf ◽

H. Reichl

Keyword(s):

Sustainable Development ◽

Environmental Compatibility

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Manufacturability and reliability of lead-free package

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290881 ◽

2004 ◽

Author(s):

A. Sriyarunya

Keyword(s):

Lead Free

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Properties and reliability of SnZn-Based lead-free solder alloys

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290861 ◽

2004 ◽

Cited By ~ 2

Author(s):

J. Villain ◽

W. Jillck ◽

E. Schmitt ◽

T. Qasim

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Free Solder

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Thermal and mechanical analysis of recycled glass filled PET for printer part

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04 ◽

10.1109/agec.2004.1290866 ◽

2004 ◽

Author(s):

Michael Koh Cheok Poh

Keyword(s):

Mechanical Analysis ◽

Recycled Glass

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2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Philips our experience in the introduction of leadfree soldering

Philips AVE entertainment policy on sustainability and environmental stewardship

Quality challenges of reused components

Closing the loop of printed-wire-boards and electronic devices: experiences from automatic disassembling as an input for manufacturers

Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist

Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processes

Environmental compatibility of electronics - a key towards local and global sustainable development

Manufacturability and reliability of lead-free package

Properties and reliability of SnZn-Based lead-free solder alloys

Thermal and mechanical analysis of recycled glass filled PET for printer part

2004 International IEEE Conference on the Asian Green Electronics (AGEC) Proceedings of AGEC-04
Latest Publications