10th IEEE International Conference of Advanced Thermal Processing of Semiconductors
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Ten years of RTP conference

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039432 ◽

2005 ◽

Author(s):

B. Lojek

Lights and shadows in european RTP history (as it happened or raight have happened)

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039462 ◽

2005 ◽

Author(s):

Z. Nenyei ◽

G. Roters

Engineering ultra-shallow junctions using fRTP/sup TM/

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1184454 ◽

2003 ◽

Cited By ~ 4

Author(s):

D.M. Camm ◽

J.C. Gelpey ◽

T. Thrum ◽

G.C. Stuart ◽

J.K. Elliott

Keyword(s):

Shallow Junctions ◽

Ultra Shallow Junctions

Comparison of silicon wafer temperature measurements using thin film thermocouples and lightpipe radiation thermometers in a thermometry test bed

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039442 ◽

2003 ◽

Cited By ~ 2

Author(s):

K.S. Ball ◽

G.Y. Tan

Keyword(s):

Thin Film ◽

Silicon Wafer ◽

Temperature Measurements ◽

Test Bed ◽

Wafer Temperature ◽

Thin Film Thermocouples

Advances in laser annealing technology for poly-Si material engineering and ultra-high-performance device fabrication

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039459 ◽

2003 ◽

Cited By ~ 2

Author(s):

A.T. Voutsas

Keyword(s):

High Performance ◽

Laser Annealing ◽

Device Fabrication ◽

Material Engineering

Integrating world-class radiance RTP technology onto a low cost of ownership production-worthy platform

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039437 ◽

2003 ◽

Author(s):

R. Boas ◽

N. Tam ◽

Wen Chang ◽

T. Leong ◽

T. Green

Keyword(s):

Low Cost ◽

Cost Of Ownership ◽

World Class

Finite element modeling of high power laser diodes

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039458 ◽

2003 ◽

Cited By ~ 1

Author(s):

M. Labudovic

Keyword(s):

Finite Element ◽

Finite Element Modeling ◽

High Power ◽

Laser Diodes ◽

High Power Laser ◽

Power Laser ◽

Element Modeling

Rapid thermal curing of low-k spin-on films

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039453 ◽

2003 ◽

Cited By ~ 1

Author(s):

R. Sharangpani ◽

Sing-Pin Tay

Keyword(s):

Thermal Curing ◽

Low K

Stress release for shallow trench isolation by single-wafer, rapid-thermal steam oxidation

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039448 ◽

2003 ◽

Cited By ~ 6

Author(s):

T. Luoh ◽

C.S. Chen ◽

L.W. Yang ◽

H.H. Shih ◽

K.C. Chen ◽

...

Keyword(s):

Steam Oxidation ◽

Stress Release ◽

Shallow Trench Isolation ◽

Trench Isolation

Application of 100% ozone gas process to rapid low-temperature oxidation

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors ◽

10.1109/rtp.2002.1039449 ◽

2003 ◽

Author(s):

H. Nonaka ◽

S. Ichimura ◽

T. Nishiguchi ◽

Y. Morikawa ◽

M. Kekura ◽

...

Keyword(s):

Low Temperature ◽

Low Temperature Oxidation ◽

Temperature Oxidation

10th IEEE International Conference of Advanced Thermal Processing of SemiconductorsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Ten years of RTP conference

Lights and shadows in european RTP history (as it happened or raight have happened)

Engineering ultra-shallow junctions using fRTP/sup TM/

Comparison of silicon wafer temperature measurements using thin film thermocouples and lightpipe radiation thermometers in a thermometry test bed

Advances in laser annealing technology for poly-Si material engineering and ultra-high-performance device fabrication

Integrating world-class radiance RTP technology onto a low cost of ownership production-worthy platform

Finite element modeling of high power laser diodes

Rapid thermal curing of low-k spin-on films

Stress release for shallow trench isolation by single-wafer, rapid-thermal steam oxidation

Application of 100% ozone gas process to rapid low-temperature oxidation

10th IEEE International Conference of Advanced Thermal Processing of Semiconductors
Latest Publications