19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications

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Published By IEEE

9781479922727, 9781479922710

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TOC therminic

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675250 ◽

2013 ◽

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Investigation of Delphi compact thermal model style for modeling surface-mounted Soft Magnetic Composite inductor

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675210 ◽

2013 ◽

Cited By ~ 3

Author(s):

Eric Monier-Vinard ◽

Valentin Bissuel ◽

Cheikh Tidiane Dia ◽

Olivier Daniel ◽

Najib Laraqi

Keyword(s):

Thermal Model ◽

Magnetic Composite ◽

Soft Magnetic ◽

Soft Magnetic Composite

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Solder joint lifetime of rapid cycled LED components

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675232 ◽

2013 ◽

Cited By ~ 3

Author(s):

Wendy Luiten

Keyword(s):

Solder Joint

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[Front cover]

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675187 ◽

2013 ◽

Keyword(s):

Front Cover

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Numerical basis and validation of CAD-centric CFD: Honeycomb heatsink study

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675222 ◽

2013 ◽

Author(s):

Travis Mikjaniec ◽

Paul Blais ◽

John Parry

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Power and thermal constraints of modern system-on-a-chip computer

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675226 ◽

2013 ◽

Cited By ~ 7

Author(s):

Efraim Rotem ◽

Ran Ginosar ◽

Avi Mendelson ◽

Uri C. Weiser

Keyword(s):

Thermal Constraints ◽

Modern System ◽

System On A Chip

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Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675189 ◽

2013 ◽

Cited By ~ 6

Author(s):

B. Wunderle ◽

C.-A. Manier ◽

M. Abo Ras ◽

M. Springborn ◽

D. May ◽

...

Keyword(s):

Design Technology ◽

Silicon Chips

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Experimental investigation of uninterrupted and interrupted microchannel heat sinks

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675195 ◽

2013 ◽

Author(s):

Ayse Gozde Ulu Soysal ◽

Cuneyt Sert ◽

Almila Guvenc Yazicioglu

Keyword(s):

Experimental Investigation ◽

Heat Sinks ◽

Microchannel Heat Sinks

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Empirical feasibility assessment of energy scavenging opportunity in compact mobile computers

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675194 ◽

2013 ◽

Cited By ~ 1

Author(s):

Muhammad Azhar Ali Khan ◽

Ali Muhtaroglu

Keyword(s):

Energy Scavenging ◽

Feasibility Assessment ◽

Mobile Computers

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Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2013.6675188 ◽

2013 ◽

Cited By ~ 2

Author(s):

M. AboRas ◽

G. Engelmann ◽

D. May ◽

M. Rothermund ◽

R. Schacht ◽

...

Keyword(s):

Thin Film ◽

Test System ◽

Test Chip ◽

Thermal Interface ◽

Interface Characterization

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19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

TOC therminic

Investigation of Delphi compact thermal model style for modeling surface-mounted Soft Magnetic Composite inductor

Solder joint lifetime of rapid cycled LED components

[Front cover]

Numerical basis and validation of CAD-centric CFD: Honeycomb heatsink study

Power and thermal constraints of modern system-on-a-chip computer

Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test

Experimental investigation of uninterrupted and interrupted microchannel heat sinks

Empirical feasibility assessment of energy scavenging opportunity in compact mobile computers

Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications