2006 International Microsystems, Package, Assembly Conference Taiwan
Latest Publications

TOTAL DOCUMENTS

51

(FIVE YEARS 0)

H-INDEX

4

(FIVE YEARS 0)

Published By IEEE

1424407346, 1424407354

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A New Nano-Probe Using Micro Assembly Transfer

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312211 ◽

2006 ◽

Author(s):

Jen-yi Chen ◽

Chun-te Lin ◽

Wei-chuan Liao ◽

Hui Chi Su ◽

Ching-hsiang Tsai ◽

...

Keyword(s):

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Capacitor and coupled inductor with high process tolerance in LTCC

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312188 ◽

2006 ◽

Author(s):

Hsin-chia Lu ◽

Tzu-wei Chao

Keyword(s):

Process Tolerance

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Effects of Photosensitive Film Sidewall Profile with Different Exposure Wavelength and Process Characteristics of Wafer Bump Technology

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312207 ◽

2006 ◽

Author(s):

Jui-i Yu ◽

Rick Yu ◽

Tom Tai ◽

Danial Huang ◽

Walter Jau ◽

...

Keyword(s):

Process Characteristics ◽

Photosensitive Film

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Lead-Free Flip Chip Package Reliability and the Finite Element-Factorial Design Methodology

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312215 ◽

2006 ◽

Author(s):

Chien-chia Chiu ◽

Chung-jung Wu ◽

Chih-tang Peng ◽

Kuo-ning Chiang ◽

Terry Ku ◽

...

Keyword(s):

Finite Element ◽

Factorial Design ◽

Design Methodology ◽

Flip Chip ◽

Lead Free ◽

Package Reliability

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Light extraction from light-emitting diodes: effect of die geometries

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312209 ◽

2006 ◽

Author(s):

Nguyen Tran ◽

Frank Shi

Keyword(s):

Light Emitting Diodes ◽

Light Extraction ◽

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The 3rd dimension-More Life for Moore's Law

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312181 ◽

2006 ◽

Author(s):

C.H. Yu

Keyword(s):

Moore’S Law ◽

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Ball Impact Responses of Wafer-level Chip-scale Packages

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312206 ◽

2006 ◽

Author(s):

Yi-shao Lai ◽

Hsiao-chuan Chang ◽

Chang-lin Yeh

Keyword(s):

Wafer Level ◽

Ball Impact ◽

Impact Responses

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No Back-pressure Effect Micro-dispenser Suction Pump

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312193 ◽

2006 ◽

Author(s):

Chun-fu Lu ◽

Jinn-cherng Yang ◽

Chien-chung Fu

Keyword(s):

Pressure Effect ◽

Back Pressure ◽

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A Study of High Sensitive Diaphragm for Silicon Microphone Applications

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312194 ◽

2006 ◽

Author(s):

Ray-hua Horng ◽

Zong-ying. Lin ◽

Yu-ning Jiang ◽

Shang-hua You ◽

Shu-zhen Zhun ◽

...

Keyword(s):

Silicon Microphone

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Nanoindentation-induced Phase Transformation of Silicon

2006 International Microsystems, Package, Assembly Conference Taiwan ◽

10.1109/impact.2006.312204 ◽

2006 ◽

Author(s):

Ping-feng Yang ◽

Sheng-rui Jian ◽

Yi-shao Lai ◽

Tsan-hsien Chen ◽

Rong-sheng Chen

Keyword(s):

Phase Transformation

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