2006 International Microsystems, Package, Assembly Conference Taiwan
Latest Publications

TOTAL DOCUMENTS

51
(FIVE YEARS 0)

H-INDEX

4
(FIVE YEARS 0)

Published By IEEE

1424407346, 1424407354
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Ball Impact Responses of Wafer-level Chip-scale Packages

2006 ◽  
Author(s):  
Yi-shao Lai ◽  
Hsiao-chuan Chang ◽  
Chang-lin Yeh
Keyword(s):  
Wafer Level ◽  
Ball Impact ◽  
Impact Responses

A New Nano-Probe Using Micro Assembly Transfer

2006 ◽  
Author(s):  
Jen-yi Chen ◽  
Chun-te Lin ◽  
Wei-chuan Liao ◽  
Hui Chi Su ◽  
Ching-hsiang Tsai ◽  
...  
Keyword(s):  
Micro Assembly

Lead-Free Flip Chip Package Reliability and the Finite Element-Factorial Design Methodology

2006 ◽  
Author(s):  
Chien-chia Chiu ◽  
Chung-jung Wu ◽  
Chih-tang Peng ◽  
Kuo-ning Chiang ◽  
Terry Ku ◽  
...  
Keyword(s):  
Finite Element ◽  
Factorial Design ◽  
Design Methodology ◽  
Flip Chip ◽  
Lead Free ◽  
Package Reliability

No Back-pressure Effect Micro-dispenser Suction Pump

2006 ◽  
Author(s):  
Chun-fu Lu ◽  
Jinn-cherng Yang ◽  
Chien-chung Fu
Keyword(s):  
Pressure Effect ◽  
Back Pressure ◽  
Suction Pump

A Study of High Sensitive Diaphragm for Silicon Microphone Applications

2006 ◽  
Author(s):  
Ray-hua Horng ◽  
Zong-ying. Lin ◽  
Yu-ning Jiang ◽  
Shang-hua You ◽  
Shu-zhen Zhun ◽  
...  
Keyword(s):  
Silicon Microphone

Nanoindentation-induced Phase Transformation of Silicon

2006 ◽  
Author(s):  
Ping-feng Yang ◽  
Sheng-rui Jian ◽  
Yi-shao Lai ◽  
Tsan-hsien Chen ◽  
Rong-sheng Chen
Keyword(s):  
Phase Transformation
Load More ...
Sign in / Sign up

Export Citation Format

Share Document