Ball Impact Responses of Wafer-level Chip-scale Packages

2006 ◽  
Author(s):  
Yi-shao Lai ◽  
Hsiao-chuan Chang ◽  
Chang-lin Yeh
Keyword(s):  
Wafer Level ◽  
Ball Impact ◽  
Impact Responses

Characterizations of ball impact responses of wafer-level chip-scale packages

2008 ◽  
Vol 450 (1-2) ◽  
pp. 238-244 ◽  
Author(s):  
Yi-Shao Lai ◽  
Chang-Lin Yeh ◽  
Hsiao-Chuan Chang ◽  
Chin-Li Kao
Keyword(s):  
Wafer Level ◽  
Ball Impact ◽  
Impact Responses

Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu ◽  
Chang-Lin Yeh ◽  
Jenn-Ming Song
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

2007 ◽  
Vol 37 (2) ◽  
pp. 201-209 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints

2009 ◽  
Vol 21 (3) ◽  
pp. 4-9
Author(s):  
Yi‐Shao Lai ◽  
C.R. Kao ◽  
Hsiao‐Chuan Chang ◽  
Chin‐Li Kao
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses ◽  
Multiple Reflow Cycles

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level
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