2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
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82

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9781424455966

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Topography and Deformation Measurement and FE Modeling applied to substrate-mounted large area wafer-level packages (including stacked dice and TSVs)

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5532239 ◽

2010 ◽

Author(s):

M. Hert ◽

S. Carniello ◽

C. Cassidy

Keyword(s):

Deformation Measurement ◽

Fe Modeling ◽

Wafer Level ◽

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Stochastic modeling of the resistive switching mechanism in oxide-based memory

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5531994 ◽

2010 ◽

Author(s):

A. Makarov ◽

V. Sverdlov ◽

S. Selberherr

Keyword(s):

Stochastic Modeling ◽

Resistive Switching ◽

Switching Mechanism ◽

Resistive Switching Mechanism

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Simple but efficient reconfiguration algorithm for degradable VLSI/WSI arrays

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5532077 ◽

2010 ◽

Author(s):

Wu Jigang ◽

Ting Lei ◽

Thambipillai Srikanthan

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Charge trapping characteristics of HfYOx gate dielectrics on SiGe

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5532234 ◽

2010 ◽

Author(s):

S. Mallik ◽

C. Mahata ◽

M. K. Hota ◽

C. K. Sarkar ◽

C. K. Maiti

Keyword(s):

Gate Dielectrics ◽

Charge Trapping

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Physical failure analysis of package qualification for new product and process

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5531977 ◽

2010 ◽

Author(s):

Yi-Chen Lin ◽

Hung-Jia Chang

Keyword(s):

Failure Analysis ◽

New Product ◽

Product And Process

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Degradation behavior of TaYOx-based metal-insulator-metal capacitors

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5531974 ◽

2010 ◽

Author(s):

M.K. Hota ◽

C. Mahata ◽

S. Mallik ◽

C.K. Sarkar ◽

C. K. Maiti

Keyword(s):

Degradation Behavior ◽

Metal Insulator ◽

Metal Insulator Metal

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300mm wafer Atomic force probe characterization methodology

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5531988 ◽

2010 ◽

Author(s):

Terence Kane

Keyword(s):

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Photovoltaics: From alternative energy to mature industry

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5532302 ◽

2010 ◽

Author(s):

Rob A. Steeman

Keyword(s):

Alternative Energy

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Optical induce tungsten plug corrosion in CMP process

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5532231 ◽

2010 ◽

Author(s):

Re-Long Chiu ◽

Jason Higgins ◽

Sharon Ying ◽

Yajiang Liu ◽

Barry Dick ◽

...

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Instability of p-channel poly-Si thin-film transistors under dynamic negative bias temperature stress

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2010.5531996 ◽

2010 ◽

Author(s):

Jie Zhou ◽

Mingxiang Wang ◽

Man Wong

Keyword(s):

Thin Film ◽

Temperature Stress ◽

Thin Film Transistors ◽

Negative Bias ◽

Bias Temperature Stress ◽

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