Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging

In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.

Roadmapping of Nanoelectronics for the New Electronics Industry

This paper is dedicated to a review of the international effort to map the future of nanoelectronics from materials to systems for the new electronics industry. The following sections are highlighted: the Roadmap structure with the international teams, the methodology and historical evolution, the various eras of scaling, the new ecosystems and computer industry, the evolving supply chain, the development of SoC and SiP, the advent of the Internet of Everything and the 5G communications, the dramatic increase of data centers, the power challenge, the technology fusion, heterogeneous and system integration, the emerging technologies, devices and computing architectures, and the main challenges for future applications.

Effective Recruitment of Engineers From Other Companies: Whether to Pull Individuals or Teams?

This study empirically analyzes effective conditions for cross-border “learning by hiring” in the electronics industry. Many previous studies have indicated that the mobility of engineers serves as a conduit for knowledge diffusion and that knowledge is more likely transferred when the geographical distance is short, that is, when the conduit is short. However, the relationship between conduit thickness and density and the knowledge spillover effect has only rarely discussed. The findings of this study suggest that it is more effective to hire multiple people simultaneously for learning by hiring from companies in other countries.

A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial

With the rapid development of the electronics industry, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life of various electronic devices is considerably shortened. Therefore, it is essential to efficiently dissipate the heat generated from the device to extend product life and ensure high efficiency of electronic components. This study evaluated how residual stress is impacted by the thickness of the deposited copper film, which is widely used as a heat dissipation material, and the number of graphene layers. The results confirmed that the residual stress decreased with increasing thickness. Moreover, the residual stress changed based on the transfer area of graphene, which had an elastic modulus eight times that of copper, indicating that the residual stress of the deposited copper film can be controlled.