2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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66

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4

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Published By IEEE

9781509054503, 9781509054510

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal analysis of advanced microelectronic devices using thermoreflectance thermography

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7749037 ◽

2016 ◽

Author(s):

Dustin Kendig ◽

Andrew Tay ◽

Ali Shakouri

Keyword(s):

Thermal Analysis ◽

Microelectronic Devices

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Thermo-mechanical assessment of copper and graphite heat spreaders for compact packages

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7748641 ◽

2016 ◽

Author(s):

R. Prieto ◽

J. P. Colonna ◽

P. Coudrain ◽

N. Chevrier ◽

K. N. Assigbe ◽

...

Keyword(s):

Heat Spreaders ◽

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Calibration of detailed thermal models by parametric dynamic compact thermal models

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7748650 ◽

2016 ◽

Author(s):

Lorenzo Codecasa ◽

Vincenzo d'Alessandro ◽

Alessandro Magnani ◽

Niccolo Rinaldi

Keyword(s):

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Delphi4LED — from measurements to standardized multi-domain compact models of LED: A new European R&D project for predictive and efficient multi-domain modeling and simulation of LEDs at all integration levels along the SSL supply chain

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7749048 ◽

2016 ◽

Author(s):

Robin Bornoff ◽

Volker Hildenbrand ◽

Sangye Lugten ◽

Genevieve Martin ◽

Christophe Marty ◽

...

Keyword(s):

Supply Chain ◽

Modeling And Simulation ◽

Domain Modeling ◽

Compact Models ◽

Integration Levels

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Improved method for logi-thermal simulation with temperature dependent signal delay

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7749071 ◽

2016 ◽

Author(s):

Lazar Jani ◽

Andras Poppe

Keyword(s):

Thermal Simulation ◽

Signal Delay ◽

Improved Method ◽

Temperature Dependent ◽

Dependent Signal

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Workshop committee

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7749082 ◽

2016 ◽

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Novel partition-based approach to dynamic compact thermal modeling

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7748652 ◽

2016 ◽

Author(s):

Lorenzo Codecasa ◽

Vincenzo d'Alessandro ◽

Alessandro Magnani ◽

Niccolo Rinaldi

Keyword(s):

Thermal Modeling ◽

Compact Thermal Modeling

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Electronic module for the thermal monitoring of a Li-ion battery cell through the electrochemical impedance estimation

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7749069 ◽

2016 ◽

Author(s):

Marco Ranieri ◽

Diego Alberto ◽

Helene Piret ◽

Viviane Cattin

Keyword(s):

Electrochemical Impedance ◽

Li Ion Battery ◽

Thermal Monitoring ◽

Battery Cell ◽

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Closing the power delivery/heat removal cycle for heterogeneous multi-scale systems

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7749034 ◽

2016 ◽

Author(s):

Mircea Stan ◽

Ke Wang ◽

Kevin Skadron

Keyword(s):

Heat Removal ◽

Power Delivery ◽

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Methodology to achieve the thermal management of a 6U conduction-cooled board with 130W power dissipation and an operating temperature of 85°C

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2016.7749047 ◽

2016 ◽

Author(s):

Jerome Maquet

Keyword(s):

Thermal Management ◽

Power Dissipation ◽

Operating Temperature

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