Realizing the large current field emission characteristics of single vertical few-layer graphene by constructing a lateral graphite heat dissipation interface

An in situ TEM result showed that a vertical few-layer graphene field emitter can carry large emission current at high temperature, benefiting from a graphite layer at the substrate interface which helps to efficiently dissipate heat during field emission.

Design of Thermal Ground Planes for Cooling of Foldable Smartphones

Foldable smartphones are expected to be widely commercialized in the near future. Thermal ground plane (TGP), known as vapor chamber or two-dimensional flat heat pipe, is a promising solution for the thermal management of foldable smartphones. There are two approaches to designing a TGP for foldable smartphones. One approach uses two TGPs connected by a graphite bridge and the other approach uses a single, large, and foldable TGP. In this study, different thermal management solutions are simulated for a representative foldable smartphone with screen dimensions of 144 × 138.3 mm2 (twice the screen of iPhone 6 s with a 10 mm gap). In addition, the simulation includes two heat sources representing a main processor with dimensions of 14.45 × 14.41 mm2 and power of 3.3 W (A9 processor in iPhone 6S) and a broadband processor with dimensions of 8.26 × 9.02 mm2 and power of 2.5 W (Qualcomm broadband processor). For the simulation, a finite element method (FEM) model is calibrated and verified by steady-state experiments of two different TGPs. The calibrated model is then used to study three different cases: a graphite heat spreader, two TGPs with a graphite hinge, and a single, large, and foldable TGP. In the fully unfolded configuration, using a graphite heat spreader, the temperature difference across the spreader's surface is about 17 °C. For the design using two TGPs connected by a graphite bridge, the temperature difference is about 7.2 °C. Finally, for the design using a single large TGP with a joint region, the temperature difference is only 1–2 °C. These results suggest that a single foldable TGP or a configuration with two TGPs outperform the graphite sheet solution for the thermal management of foldable smartphones.

Design and Testing of High-Performance Mini-Channel Graphite Heat Exchangers in Thermoelectric Energy Recovery Systems

Recent national energy usage studies by Lawrence Livermore National Laboratory in 2015 [1] show that there is approximately 59 Quads (1015 Btu’s) of waste thermal energy throughout various industrial, residential, power generation, and transportation sectors of the U.S. economy. Thermoelectric energy recovery is one important technology for recovering this waste thermal energy in high-temperature industrial, transportation and military energy systems. Thermoelectric generator (TEG) systems in these applications require high performance hot-side and cold-side heat exchangers to provide the critical temperature differential and transfer the required thermal energy. High performance hot-side heat exchangers in these systems are often metal-based due to requirements for high-temperature operation, strength at temperature, corrosion resistance, and chemical stability. However, the generally selected metal-based hot-side heat exchangers (i.e., Inconels, Stainless Steels) suffer from low thermal conductivity, high thermal expansion, and high density, which degrades their thermal performance, leads to high thermal-expansion-driven stresses, and creates relatively high mass/high volume (i.e., low power density) TEG systems that are then difficult to fabricate and integrate into viable energy recovery systems. This paper describes the design and testing of a new, high-temperature minichannel graphite heat exchanger designed for operation up to 500°C that is a critical element of a high-power-density TEG power system for aircraft energy recovery. This high-performance graphite heat exchanger represents a new state-of-the-art standard in high-temperature heat exchangers for TEG systems, which provides higher thermal transport, less thermal expansion at operation, lower system level stresses on TE components, and a lighter weight TEG system. This new heat exchanger creates a new design paradigm in TEG system design for terrestrial energy recovery and potential NASA technology infusion into terrestrial energy system applications. This paper will present and discuss the key heat transfer, pressure drop, pumping power analyses and design tradeoffs that created this unique design. Heat transfer and pressure drop modeling was performed with both empirical models based on known heat transfer and friction factor correlations and COMSOL thermal/fluid dynamic modeling of the graphite heat exchanger structure. We will also discuss resulting thermal transport and heat fluxes predicted at the TEG interface level. Heat exchanger performance testing was performed under simulated operating conditions and correlation with test data at the anticipated operating temperature conditions will be presented and discussed.