2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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9781479977277
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A new MHC catalyst system — Nano-Silver

2014 ◽  
Author(s):  
Wenjia Zhou ◽  
Suk-Kwan Kwong ◽  
Chit-Yiu Chan ◽  
Kwok-Wai Yee
Keyword(s):  
Catalyst System ◽  
Nano Silver

Adhesive enabling technology for directly plating copper onto glass

2014 ◽  
Author(s):  
Kenichiroh Mukai ◽  
Tafadzwa Magaya ◽  
Lutz Brandt ◽  
Zhiming Liu ◽  
Hailuo Fu ◽  
...  
Keyword(s):  
Enabling Technology

The failure behavior of the fine pitch SnAg bump under current stressing

2014 ◽  
Author(s):  
Yu-Hsiu Shao ◽  
Ying-Ta Chiu ◽  
Chin-Lin Kao ◽  
Ping-Feng Yang
Keyword(s):  
Failure Behavior ◽  
Current Stressing ◽  
Fine Pitch

Design, simulation and fabrication of MEMS Lorentz force sensor

2014 ◽  
Author(s):  
Chung-Yang Sue ◽  
Sheng-Ren Chiu ◽  
Chun-Yin Tsai ◽  
Shi Chen ◽  
Chin-Fu Kuo ◽  
...  
Keyword(s):  
Lorentz Force ◽  
Force Sensor

Electroplated copper filling of through holes on varying substrate thickness

2014 ◽  
Author(s):  
Kesheng Feng ◽  
Bill DeCesare ◽  
Mike Yu ◽  
Don DeSalvo ◽  
Jim Watkowski
Keyword(s):  
Substrate Thickness ◽  
Electroplated Copper
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