2014 International Conference on Electronics Packaging (ICEP)
Latest Publications

TOTAL DOCUMENTS

152

(FIVE YEARS 0)

H-INDEX

6

(FIVE YEARS 0)

Published By IEEE

9784904090114, 9784904090107

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Reliability characterization of 2.5D multi-chip module on board under drop impact

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826691 ◽

2014 ◽

Author(s):

Tzu-Hsuan Cheng ◽

Hsien-Chie Cheng ◽

Wen-Hwa Chen ◽

Hsin-Yi Huang ◽

Tao-Chih Chang

Keyword(s):

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Basic study on flow and heat transfer performance of pulsating air flow for application to electronics cooling

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826662 ◽

2014 ◽

Author(s):

Mutsuki Kichima ◽

Takashi Fukue ◽

Koichi Hirose

Keyword(s):

Heat Transfer ◽

Heat Transfer Performance ◽

Air Flow ◽

Electronics Cooling ◽

Transfer Performance ◽

Basic Study ◽

Flow And Heat Transfer

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Preparation of aligned conjugated polymer fibers by electrospinning

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826788 ◽

2014 ◽

Author(s):

Hsiao-Chung Chu ◽

Cho-Liang Chung ◽

Yu-Hsuan Lin ◽

Chun-Yang Pan ◽

Sheng-Li Fu

Keyword(s):

Conjugated Polymer ◽

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Thermal management of embedded device package

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826745 ◽

2014 ◽

Author(s):

Yukari Imaizumi ◽

Toru Suda ◽

Shigenori Sawachi ◽

Akio Katsumata ◽

Yoichi Hiruta

Keyword(s):

Thermal Management ◽

Embedded Device

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Electromagnetic field analysis of human body communication between wearable and stationary devices including the earth ground

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826780 ◽

2014 ◽

Author(s):

Misaki Kurosu ◽

Fukuro Koshiji ◽

Kohji Koshiji

Keyword(s):

Electromagnetic Field ◽

Field Analysis ◽

The Earth ◽

Human Body Communication

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Fine-pitch solder joining for high density interconnection

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826750 ◽

2014 ◽

Author(s):

Kuniaki Sueoka ◽

Sayuri Kohara ◽

Akihiro Horibe ◽

Fumiaki Yamada ◽

Hiroyuki Mori ◽

...

Keyword(s):

High Density ◽

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Pin open detection of BGA IC by supply current testing

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826695 ◽

2014 ◽

Author(s):

Akira Ono ◽

Hiroyuki Yotsuyanagi ◽

Masaki Hashizume

Keyword(s):

Current Testing ◽

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Clarification of transmission mechanism in Human body communication between head-mounted wearable devices with detailed model

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826779 ◽

2014 ◽

Author(s):

D. Muramatsu ◽

Y. Yokoyama ◽

K. Sasaki

Keyword(s):

Wearable Devices ◽

Transmission Mechanism ◽

Detailed Model ◽

Human Body Communication

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Measurements of electrical resistance and temperature distribution during current assisted sintering of nanosilver die-attach material

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826737 ◽

2014 ◽

Author(s):

Guo-Quan Lu ◽

Wanli Li ◽

Yunhui Mei ◽

Xin Li

Keyword(s):

Temperature Distribution ◽

Electrical Resistance ◽

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Relationship between shrinkage and conductivity properties of cured isotropic conductive adhesives

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826703 ◽

2014 ◽

Author(s):

Shigeru Kohinata ◽

Yoshihiko Shiraki ◽

Masahiro Inoue ◽

Keisuke Uenishi

Keyword(s):

Conductive Adhesives ◽

Isotropic Conductive Adhesives

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