2007 International Microsystems, Packaging, Assembly and Circuits Technology
Latest Publications

TOTAL DOCUMENTS

91

(FIVE YEARS 0)

H-INDEX

5

(FIVE YEARS 0)

Published By IEEE

9781424416363

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433621 ◽

2007 ◽

Author(s):

Pei-Chieh Chin ◽

Chin-Yuan Hu ◽

Hsiang-Chen Hsu ◽

Shen-Li Fu ◽

Chang-Lin Yeh ◽

...

Keyword(s):

Heat Affected Zone ◽

Transient Analysis ◽

Gold Wire ◽

Wire Bonding ◽

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Tin whisker growth induced by high electron current density

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433568 ◽

2007 ◽

Author(s):

Y. W. Lin ◽

C. Robert Kao

Keyword(s):

Current Density ◽

Whisker Growth ◽

High Electron ◽

Electron Current ◽

Tin Whisker ◽

Electron Current Density ◽

High Electron Current

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Underfill selection strategy for low k, high lead/lead-free flip chip application

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433631 ◽

2007 ◽

Author(s):

W. H. Lee ◽

D. S. Jiang ◽

Y. P. Wang ◽

C. S. Hsiao

Keyword(s):

Flip Chip ◽

Lead Free ◽

Selection Strategy ◽

Low K ◽

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On-chip high-Q inductor using wafer-level chip-scale package technology

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433594 ◽

2007 ◽

Author(s):

Hsueh-An Yang ◽

Chen-Chao Wang ◽

Po-Jen Zheng ◽

Wei-Chung Wang

Keyword(s):

Wafer Level ◽

High Q ◽

Chip Scale Package ◽

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Characteristics of Copper-to-Silicon diffusion in copper wire bonding

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433556 ◽

2007 ◽

Author(s):

Shawn X. Zhang ◽

S. W. Ricky Lee ◽

A. K. M. Lau ◽

P. P. H. Tsang ◽

L. Mohamed ◽

...

Keyword(s):

Copper Wire ◽

Wire Bonding ◽

Copper Wire Bonding ◽

Silicon Diffusion

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Shape optimization of micromachined biosensing cantilevers

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433622 ◽

2007 ◽

Author(s):

Kun-Nan Chen ◽

Sun-Po Yu

Keyword(s):

Shape Optimization

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The use of modified oxide process for lead-free application

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433606 ◽

2007 ◽

Author(s):

Williams Lin ◽

David Lin ◽

Keven Hsu ◽

K. S. Chang ◽

Charley Chu

Keyword(s):

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Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433577 ◽

2007 ◽

Author(s):

S. C. Yang ◽

C. R. Kao

Keyword(s):

Interfacial Reaction ◽

Lead Free ◽

Zn Addition ◽

Lead Free Solders

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Theoretical and experimental characterization of process-induced thermal-mechanical behaviors of an ultra-thin chip-on-film assembly

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433626 ◽

2007 ◽

Author(s):

Hsien-Chie Cheng ◽

Hsiang-Chung Ho ◽

Su-Tsai Lu

Keyword(s):

Experimental Characterization ◽

Mechanical Behaviors ◽

Film Assembly ◽

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A schematic-based design model for microphone and circuit integration

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433590 ◽

2007 ◽

Author(s):

Jen-Yi Chen ◽

Shu-Sheng Lee ◽

Peter Chang ◽

Chun-Hsun Chu ◽

Tamal Mukherjee ◽

...

Keyword(s):

Design Model ◽

Circuit Integration

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