2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)
Latest Publications

TOTAL DOCUMENTS

116

(FIVE YEARS 0)

H-INDEX

3

(FIVE YEARS 0)

Published By IEEE

9781538637128

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421434 ◽

2018 ◽

Author(s):

Zhen Cui ◽

Yingying Zhang ◽

Qun Yang ◽

Guoqi Zhang ◽

Xianping Chen

Keyword(s):

Electronic Packaging ◽

Multiscale Modelling ◽

Interfacial Failure ◽

Modelling Approach

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Embedded Tunable Near Infrared Sensor with Programmable Potential Barrier on Nano-meter CMOS Platforms

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421500 ◽

2018 ◽

Author(s):

Zih-Hong Chen ◽

Chien-Ping Wang ◽

Po-Hsiang Huang ◽

Yue-Der Chih ◽

Jonathan Chang ◽

...

Keyword(s):

Potential Barrier ◽

Near Infrared ◽

Infrared Sensor

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Ge FinFET CMOS Inverters with Improved Channel Surface Roughness by Using In-situ ALD Digital O3 Treatment

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421457 ◽

2018 ◽

Author(s):

M.-S. Yeh ◽

G.-L. Luo ◽

F.-J. Hou ◽

P.-J. Sung ◽

C.-J. Wang ◽

...

Keyword(s):

Surface Roughness ◽

Channel Surface

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A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421528 ◽

2018 ◽

Author(s):

SeungNam Son ◽

HoDol Yoo ◽

Ji Hyun Kim ◽

JooHyun Kim ◽

DooWon Lee ◽

...

Keyword(s):

High Density ◽

Heterogeneous Integration

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Ballistic Mobility Model for QDD Simulation of Ultra-short Transistors

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421514 ◽

2018 ◽

Author(s):

P. Aguirre ◽

A. Schenk

Keyword(s):

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The Sub-micron GaN HEMT Device on 200mm Si(111) Wafer with Low Wafer Bow

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421503 ◽

2018 ◽

Author(s):

Chieh-Chih Huang ◽

Zhihong Liu ◽

Weichuan Xing ◽

Geok Ing Ng ◽

Eugene A Fitzgerald ◽

...

Keyword(s):

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Design Considerations of Ferroelectric Properties for Negative Capacitance MOSFETs

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421443 ◽

2018 ◽

Author(s):

Ali Saeidi ◽

Farzan Jazaeri ◽

Igor Stolichnov ◽

Christian C. Enz ◽

Adrian M. Ionescu

Keyword(s):

Ferroelectric Properties ◽

Negative Capacitance ◽

Design Considerations

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Low Cost and Highly Manufacturable MOL/BEOL Constructs in 22FDSOI Technology for High Performance and Low Power Applications

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421481 ◽

2018 ◽

Author(s):

Navneet Jain ◽

Juhan Kim ◽

Sushama Davar ◽

Shibly Ahmed ◽

Jeff Kim ◽

...

Keyword(s):

Low Power ◽

High Performance ◽

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Suppressing Oxidation-Enhanced Diffusion of Boron via Buried Epitaxial Oxygen-Inserted Layers in Silicon

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421512 ◽

2018 ◽

Author(s):

Daniel Connelly ◽

Richard Burton ◽

Nyles W. Cody ◽

Pavel Fastenko ◽

Marek Hytha ◽

...

Keyword(s):

Enhanced Diffusion

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Comprehensive 3D TSV Reliability Study on 14nm FINFET Technology with Thinned Wafers

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) ◽

10.1109/edtm.2018.8421432 ◽

2018 ◽

Author(s):

C.S. Premachandran ◽

Rakesh Ranjan ◽

Luke England ◽

Patrick Justison ◽

Salvatore Cimino ◽

...

Keyword(s):

Reliability Study

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