2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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373
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15
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9781479924073
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Package-level electromagnetic interference analysis

2014 ◽  
Author(s):  
Namhoon Kim ◽  
Leo Hongyu Li ◽  
Sam Karikalan ◽  
Reza Sharifi ◽  
Henry Kim
Keyword(s):  
Electromagnetic Interference ◽  
Interference Analysis

Assembly and packaging technologies for high-temperature and high-power GaN HEMTs

2014 ◽  
Author(s):  
A. A. Bajwa ◽  
Y. Qin ◽  
J. Wilde ◽  
R. Reiner ◽  
P. Waltereit ◽  
...  
Keyword(s):  
High Temperature ◽  
High Power ◽  
Gan Hemts

Computational investigation of failure in anodized aluminum

2014 ◽  
Author(s):  
Sabrina Ball ◽  
Ibrahim Guven ◽  
Pankaj Sinha ◽  
Rajiv Rastogi ◽  
Brian McCarson
Keyword(s):  
Computational Investigation ◽  
Anodized Aluminum

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

2014 ◽  
Author(s):  
Bing Dang ◽  
Joana Maria ◽  
Qianwen Chen ◽  
Jae-Woong Nah ◽  
Paul Andry ◽  
...  

Advancements in fabrication of glass interposers

2014 ◽  
Author(s):  
Aric Shorey ◽  
Philippe Cochet ◽  
Alan Huffman ◽  
John Keech ◽  
Matt Lueck ◽  
...  

First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers

2014 ◽  
Author(s):  
Kaya Demir ◽  
Andac Armutlulu ◽  
Jialing Tong ◽  
Raghuram Pucha ◽  
Venkatesh Sundaram ◽  
...  
Keyword(s):  
Bare Glass
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