2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

373

(FIVE YEARS 0)

H-INDEX

15

(FIVE YEARS 0)

Published By IEEE

9781479924073

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Lithography challenges for 2.5D interposer manufacturing

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897334 ◽

2014 ◽

Author(s):

Klaus Ruhmer Philippe Cochet ◽

Roger McCleary ◽

Rich Rogoff ◽

Rajiv Roy

Download Full-text

Crack monitoring and life modeling technique towards high thermal cyclic and mechanical reliability of fcBGA solder joint

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897277 ◽

2014 ◽

Author(s):

Dongji Xie ◽

Zhongming Wu ◽

Min Woo ◽

Tom McMullen

Keyword(s):

Solder Joint ◽

Modeling Technique ◽

Mechanical Reliability ◽

Crack Monitoring

Download Full-text

Through-glass interposer integrated high quality RF components

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897427 ◽

2014 ◽

Author(s):

Cheolbok Kim ◽

David E. Senior ◽

Aric Shorey ◽

Hyup Jong Kim ◽

Windsor Thomas ◽

...

Keyword(s):

High Quality ◽

Download Full-text

Wafer level warpage characterization for backside manufacturing processes of TSV interposers

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897532 ◽

2014 ◽

Author(s):

Feng Jiang ◽

Qibin Wang ◽

Kai Xue ◽

Xiangmeng Jing ◽

Daquan Yu ◽

...

Keyword(s):

Manufacturing Processes ◽

Download Full-text

Improvement of the crystallinity of electroplated copper thin films for highly reliable 3D interconnections

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897558 ◽

2014 ◽

Author(s):

Chuanhong Fan ◽

Osamu Asai ◽

Ryosuke Furuya ◽

Ken Suzuki ◽

Hideo Miura

Keyword(s):

Electroplated Copper

Download Full-text

A novel molding process for wafer level LED packaging using uniform micro glass bubble arrays

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897626 ◽

2014 ◽

Author(s):

Yu Zou ◽

Jintang Shang ◽

Yu Ji ◽

Li Zhang ◽

Chiming Lai ◽

...

Keyword(s):

Wafer Level ◽

Molding Process ◽

Download Full-text

Development of process and design criteria for stress management in through silicon vias

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897351 ◽

2014 ◽

Author(s):

O. Holck ◽

M. Nuss ◽

A. Grams ◽

T. Prewitz ◽

P. John ◽

...

Keyword(s):

Stress Management ◽

Design Criteria ◽

Through Silicon Vias ◽

Download Full-text

Analysis on interference between Multi-Giga bit display serial link and RF components in Smart Mobile Device

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897369 ◽

2014 ◽

Author(s):

Youchul Jeong ◽

Jaemin Kim ◽

Baegin Sung

Keyword(s):

Mobile Device ◽

Serial Link ◽

Rf Components ◽

Download Full-text

MEMS-based implantable heart monitoring system with integrated pacing function

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897279 ◽

2014 ◽

Author(s):

Fjodors Tjulkins ◽

Anh Tuan Thai Nguyen ◽

Erik Andreassen ◽

Nils Hoivik ◽

Knut Aasmundtveit ◽

...

Keyword(s):

Monitoring System ◽

Heart Monitoring

Download Full-text

Design and demonstration of paper-thin and low-warpage single and 3D organic packages with chip-last embedding technology for smart mobile applications

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897473 ◽

2014 ◽

Author(s):

Sung Jin Kim ◽

Zihan Wu ◽

Makoto Kobayashi ◽

Fuhan Liu ◽

Vanessa Smet ◽

...

Keyword(s):

Mobile Applications ◽

Organic Packages ◽

Download Full-text