Assembly and packaging technologies for high-temperature and high-power GaN HEMTs
Keyword(s):
1999 ◽
Vol 38
(Part 1, No. 2B)
◽
pp. 1234-1238
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2009 ◽
Vol 193
◽
pp. 012040
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2014 ◽
Vol 54
(3)
◽
pp. 575-581
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Keyword(s):
1997 ◽
Vol 41
(10)
◽
pp. 1569-1574
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