2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
Latest Publications

TOTAL DOCUMENTS

103

(FIVE YEARS 103)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781728189116

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Methodology to determine high precision variation in the electrical resistance of copper wires due to corrosion

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315088 ◽

2020 ◽

Author(s):

Michael Joo Zhong Lim ◽

Michael Goroll ◽

Hai Guan Loh ◽

Zhong Chen ◽

Chuan Seng Tan

Keyword(s):

High Precision ◽

Electrical Resistance

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Development of Pressure Sensing Array System for Retail Inventory Management

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315015 ◽

2020 ◽

Author(s):

Ruiqi Lim ◽

David Sze Wai Choong ◽

Ming-Yuan Cheng

Keyword(s):

Inventory Management ◽

Pressure Sensing

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Electrical characterization and design of hyper-dense interconnect on HD-FOWLP for die to die connectivity for AI and ML accelerator applications

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315178 ◽

2020 ◽

Author(s):

Mihai Dragos Rotaru ◽

Li Kangrong

Keyword(s):

Electrical Characterization

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Micromorphology analysis of Sn-3.0Ag-0.5Cu solder under compression in wide ranges of temperature and strain rate

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315063 ◽

2020 ◽

Author(s):

Junmeng Xu ◽

Chuantong Chen ◽

Xu Long

Keyword(s):

Strain Rate

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Material Removal Rate Prediction using the Classification-Regression Approach

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315140 ◽

2020 ◽

Author(s):

Kart-Leong Lim ◽

Rahul Dutta

Keyword(s):

Material Removal Rate ◽

Material Removal ◽

Removal Rate ◽

Rate Prediction ◽

Regression Approach

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Establishing Thermal Air-cooled Limit for High Performance Electronics Devices

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315139 ◽

2020 ◽

Author(s):

Gamal Refai-Ahmed ◽

Hoa Do ◽

Yaser Hadad ◽

Srikanth Rangarajan ◽

Bahgat G Sammakia ◽

...

Keyword(s):

High Performance

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Application of Face-Centered Central Composite Design for the Optimization of Chemical Etching Process of QFN-mr Package Using Alkaline-Based Chemical Solution

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315087 ◽

2020 ◽

Author(s):

Rohn Kenneth L. Serapio ◽

Ernesto T. Antilano ◽

Alvin S. Soreda

Keyword(s):

Central Composite Design ◽

Chemical Etching ◽

Etching Process ◽

Chemical Solution ◽

Face Centered ◽

Central Composite

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Surface Characterization and Leadframe-to-Mold Adhesion Performance of Oxidation-Roughened Leadframes

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315090 ◽

2020 ◽

Author(s):

Matthew M. Fernandez ◽

Richard Jan Malifer

Keyword(s):

Surface Characterization ◽

Adhesion Performance

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Hybrid 3D Package with RDL and Laminate Substrate for Ultra-Thin and High-Bandwidth Applications

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315082 ◽

2020 ◽

Author(s):

JaeYoon Kim ◽

KyeRyung Kim ◽

EunYoung Lee ◽

SeHwan Hong ◽

JuHong Shin ◽

...

Keyword(s):

High Bandwidth ◽

3D Package

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Redistribution Layer Defect Classification Using Computer Vision Techniques And Machine Learning

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc50525.2020.9315117 ◽

2020 ◽

Author(s):

Sachin Dangayach ◽

Prayudi Lianto ◽

Satwik Swarup Mishra

Keyword(s):

Machine Learning ◽

Computer Vision ◽

Defect Classification ◽

Layer Defect

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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Methodology to determine high precision variation in the electrical resistance of copper wires due to corrosion

Development of Pressure Sensing Array System for Retail Inventory Management

Electrical characterization and design of hyper-dense interconnect on HD-FOWLP for die to die connectivity for AI and ML accelerator applications

Micromorphology analysis of Sn-3.0Ag-0.5Cu solder under compression in wide ranges of temperature and strain rate

Material Removal Rate Prediction using the Classification-Regression Approach

Establishing Thermal Air-cooled Limit for High Performance Electronics Devices

Application of Face-Centered Central Composite Design for the Optimization of Chemical Etching Process of QFN-mr Package Using Alkaline-Based Chemical Solution

Surface Characterization and Leadframe-to-Mold Adhesion Performance of Oxidation-Roughened Leadframes

Hybrid 3D Package with RDL and Laminate Substrate for Ultra-Thin and High-Bandwidth Applications

Redistribution Layer Defect Classification Using Computer Vision Techniques And Machine Learning

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
Latest Publications