2016 China Semiconductor Technology International Conference (CSTIC)
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9781467388047
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Void-free underfill encapsulation for flip chip high voltage LED packaging

2016 ◽  
Author(s):  
Andrew W. Shang ◽  
Xing Qiu ◽  
Jeffery C. C. Lo ◽  
S. W. Ricky Lee ◽  
Fred F. Le
Keyword(s):  
High Voltage ◽  
Flip Chip

Study of surface control during barrier layer etch

2016 ◽  
Author(s):  
Weijun Luo ◽  
Bao Shang Ma ◽  
Fei Shen ◽  
Zhijie Hao ◽  
JunWen Huang ◽  
...  
Keyword(s):  
Barrier Layer ◽  
Surface Control

Photolithography study for high-density integration technologies

2016 ◽  
Author(s):  
Hiromi Suda ◽  
Masaki Mizutani ◽  
Shin-Ichiro Hirai ◽  
Ken-Ichiro Mori ◽  
Seiya Miura
Keyword(s):  
High Density
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