2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

ITherm 2018 Copyright Page

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419610 ◽

2018 ◽

Experimental Measurement of the Effect of Particle Concentration on the Specific Heat Capacity of Silica Nanofluids

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419554 ◽

2018 ◽

Cited By ~ 2

Author(s):

Binjian Ma ◽

Navin Kumar ◽

Aditya Kuchibhotla ◽

Debjyoti Banerjee

Keyword(s):

Heat Capacity ◽

Specific Heat ◽

Specific Heat Capacity ◽

Experimental Measurement ◽

Particle Concentration

Board Level Solder Joint Reliability Assessment Study of Megtron 6 Vs FR-4 Under Power Cycling and Thermal Cycling

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419505 ◽

2018 ◽

Cited By ~ 3

Author(s):

Jyotirmoy Denria ◽

Pavan Rajmane ◽

Dereje Agonafer

Keyword(s):

Solder Joint ◽

Thermal Cycling ◽

Reliability Assessment ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Assessment Study ◽

Power Cycling ◽

Board Level

Comparison of FEA Modeling Techniques for Plastic Ball Grid Array Assemblies

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419498 ◽

2018 ◽

Cited By ~ 1

Author(s):

Chienchih Chen ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Ball Grid Array ◽

Fea Modeling ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Modeling Techniques

Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419624 ◽

2018 ◽

Cited By ~ 2

Author(s):

Pradeep Lall ◽

Shantanu Deshpande ◽

Nakul Kothari ◽

Luu Nguyen

Keyword(s):

Fatigue Reliability

Fast Prediction of Thermal Throttling Design in M.2 Solid State Drive

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419576 ◽

2018 ◽

Cited By ~ 2

Author(s):

Yangming Liu ◽

Ning Ye ◽

Ernold Thompson ◽

Dmitry Vaysman ◽

In-Soo Yoon ◽

...

Keyword(s):

Solid State ◽

Solid State Drive ◽

Fast Prediction

Numerical and Experimental Investigation of Vertically Aligned Carbon Nanotube-Phase Change Material Composites for Thermal Management of Electronics

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419561 ◽

2018 ◽

Author(s):

Makita R. Phillips ◽

Craig E. Green ◽

Baratunde A. Cola

Keyword(s):

Experimental Investigation ◽

Carbon Nanotube ◽

Phase Change ◽

Phase Change Material ◽

Thermal Management ◽

Thermal Management Of Electronics ◽

Vertically Aligned ◽

Change Material

Optimization of TEG for Human Body Powered Mobile Devices

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419634 ◽

2018 ◽

Cited By ~ 1

Author(s):

Jiahui Cao

Keyword(s):

Mobile Devices ◽

Human Body

Two-Phase Flow Characteristics in Radial Expanding Channels with Embedded Pin Fins

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419632 ◽

2018 ◽

Author(s):

Mark D. Schultz ◽

Michael Gaynes ◽

Pritish R. Parida ◽

Fanghao Yang ◽

Gerard McVicker ◽

...

Keyword(s):

Two Phase Flow ◽

Flow Characteristics ◽

Phase Flow ◽

Two Phase ◽

Pin Fins

Thermal Expansion Investigation of Liquid Cold Plate with Varying Ambient Temperature at Storage

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419464 ◽

2018 ◽

Cited By ~ 2

Author(s):

Murat Parlak ◽

Vedat Yagci

Keyword(s):

Thermal Expansion ◽

Ambient Temperature ◽

Cold Plate

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

ITherm 2018 Copyright Page

Experimental Measurement of the Effect of Particle Concentration on the Specific Heat Capacity of Silica Nanofluids

Board Level Solder Joint Reliability Assessment Study of Megtron 6 Vs FR-4 Under Power Cycling and Thermal Cycling

Comparison of FEA Modeling Techniques for Plastic Ball Grid Array Assemblies

Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System

Fast Prediction of Thermal Throttling Design in M.2 Solid State Drive

Numerical and Experimental Investigation of Vertically Aligned Carbon Nanotube-Phase Change Material Composites for Thermal Management of Electronics

Optimization of TEG for Human Body Powered Mobile Devices

Two-Phase Flow Characteristics in Radial Expanding Channels with Embedded Pin Fins

Thermal Expansion Investigation of Liquid Cold Plate with Varying Ambient Temperature at Storage

Export Citation Format

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

ITherm 2018 Copyright Page

Experimental Measurement of the Effect of Particle Concentration on the Specific Heat Capacity of Silica Nanofluids

Board Level Solder Joint Reliability Assessment Study of Megtron 6 Vs FR-4 Under Power Cycling and Thermal Cycling

Comparison of FEA Modeling Techniques for Plastic Ball Grid Array Assemblies

Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System

Fast Prediction of Thermal Throttling Design in M.2 Solid State Drive

Numerical and Experimental Investigation of Vertically Aligned Carbon Nanotube-Phase Change Material Composites for Thermal Management of Electronics

Optimization of TEG for Human Body Powered Mobile Devices

Two-Phase Flow Characteristics in Radial Expanding Channels with Embedded Pin Fins

Thermal Expansion Investigation of Liquid Cold Plate with Varying Ambient Temperature at Storage

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications