2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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195

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7

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Published By IEEE

9781538612729

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A Heat Spreading Model for Double-Sided, Cross-Flow, Manifold-Microchannel Heat Exchangers

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419553 ◽

2018 ◽

Author(s):

Raphael Mandel ◽

Martinus Arie ◽

Amir Shooshtari ◽

Michael Ohadi

Keyword(s):

Heat Exchangers ◽

Spreading Model ◽

Heat Spreading ◽

Manifold Microchannel

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ITherm 2018 Cover Page

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419606 ◽

2018 ◽

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Transient Data Center Temperatures After a Primary Power Outage

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419583 ◽

2018 ◽

Author(s):

Christopher M. Healey ◽

James W. VanGilder ◽

Michael Condor ◽

Wei Tian

Keyword(s):

Data Center ◽

Power Outage ◽

Primary Power ◽

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ITherm 2018 Sponsors & Vendor Exhibits

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419552 ◽

2018 ◽

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Fluid Dynamics and Heat Transfer Generated by a Pair of Adjacent Impinging Synthetic Jets

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419574 ◽

2018 ◽

Author(s):

Jean Paul DrAlencon ◽

David A. Gallardo ◽

Luis Silva-Llanca

Keyword(s):

Heat Transfer ◽

Fluid Dynamics ◽

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Data Driven Prediction Model (DDPM) for Server Inlet Temperature Prediction in Raised-floor Data Centers

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419650 ◽

2018 ◽

Author(s):

Raymond Lloyd ◽

Marek Rebow

Keyword(s):

Prediction Model ◽

Data Centers ◽

Data Driven ◽

Inlet Temperature ◽

Temperature Prediction

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Exploration of a Hybrid Analytical Thermal Topology Optimization Method for an Additively Manufactured Heat Sink

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419585 ◽

2018 ◽

Author(s):

H. Peter de Bock

Keyword(s):

Topology Optimization ◽

Heat Sink ◽

Optimization Method ◽

Topology Optimization Method

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Kapton RS Flexible Heaters – Design and Applications

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419521 ◽

2018 ◽

Author(s):

Kalyan Rapolu ◽

Shannon Dugan ◽

Matthew Manelis ◽

Jonathan Weldon ◽

Richard Wessel

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Thermal Performance Comparison of Advanced 3D Packaging Concepts for Logic and Memory Integration in Mobile Cooling Conditions

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419590 ◽

2018 ◽

Author(s):

Herman Oprins ◽

Vladimir Cherman ◽

Eric Beyne

Keyword(s):

Thermal Performance ◽

Performance Comparison ◽

Cooling Conditions ◽

Memory Integration ◽

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Influence of Structure and Wettability of Porous Silver Surfaces on Enhancing Phase Change Heat Transfer

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419651 ◽

2018 ◽

Author(s):

G. J. Gouws ◽

B. Sherson ◽

A. Sinnathambi ◽

R. Babu ◽

C.P. Moore

Keyword(s):

Heat Transfer ◽

Phase Change ◽

Porous Silver ◽

Phase Change Heat Transfer ◽

Silver Surfaces

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