2016 International Conference on Electronics Packaging (ICEP)
Latest Publications

TOTAL DOCUMENTS

147

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6

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Published By IEEE

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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Framework for implementing material alternatives assessment

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486791 ◽

2016 ◽

Author(s):

Haley Fu ◽

Stephen Tisdale ◽

Mark Schaffer

Keyword(s):

Alternatives Assessment

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Ultra low loss build-up film for fine pitch applications

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486779 ◽

2016 ◽

Author(s):

Aya Kasahara ◽

Tetsuro Iwakura ◽

Yusuke Kondo ◽

Tetsuro Irino ◽

Hiroshi Shimizu

Keyword(s):

Low Loss ◽

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Photolithography study for advanced packaging technologies

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486893 ◽

2016 ◽

Author(s):

Hiromi Suda ◽

Masaki Mizutani ◽

Shin-Ichiro Hirai ◽

Ken-Ichiro Mori ◽

Seiya Miura

Keyword(s):

Advanced Packaging

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Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486884 ◽

2016 ◽

Author(s):

Christoph Friedrich Bayer ◽

Uwe Waltrich ◽

Amal Soueidan ◽

Eberhard Baer ◽

Andreas Schletz

Keyword(s):

Field Strength ◽

Electric Field ◽

Electric Field Strength ◽

Partial Discharge ◽

Partial Discharges ◽

Ceramic Substrates ◽

Discharge Measurements

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Investigation of thermal cycling maximum temperature effect on fatigue life of WLCSP

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486771 ◽

2016 ◽

Author(s):

Min-Hsuan Hsu ◽

Kuo-Ning Chiang

Keyword(s):

Fatigue Life ◽

Thermal Cycling ◽

Temperature Effect ◽

Maximum Temperature

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A novel approach for forming ductile Cu-to-Cu interconnection

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486873 ◽

2016 ◽

Author(s):

Che-yu Yeh ◽

Yi-kai Kuo ◽

Shih-kang Lin

Keyword(s):

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Relationship between mechanical and electrical properties of Cu wire and Al pad bonding

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486879 ◽

2016 ◽

Author(s):

Y. Ishida ◽

K. Sunahara

Keyword(s):

Electrical Properties ◽

Mechanical And Electrical Properties

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Development of a Ag/glass die attach adhesive for high power and high use temperature applications

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486838 ◽

2016 ◽

Author(s):

Maciej Patelka ◽

Noriyuki Sakai ◽

Cathy Trumble

Keyword(s):

Temperature Applications

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Through Mold Via (TMV) by gas-aided laser

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486897 ◽

2016 ◽

Author(s):

Hsiang-Chen Hsu ◽

Shih-Jeh Wu ◽

Wen-Fei Lin ◽

Chi-Shiung Hsi ◽

Hsing-Yi Pao ◽

...

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A comparison study of electromigration in In-48Sn solder interconnects with Cu and Au/Ni/Cu pads

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486920 ◽

2016 ◽

Author(s):

Yi Li ◽

Y.C. Chan ◽

Fengshun Wu

Keyword(s):

Comparison Study ◽

Solder Interconnects

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