2016 International Conference on Electronics Packaging (ICEP)
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Ultra low loss build-up film for fine pitch applications

2016 ◽  
Author(s):  
Aya Kasahara ◽  
Tetsuro Iwakura ◽  
Yusuke Kondo ◽  
Tetsuro Irino ◽  
Hiroshi Shimizu
Keyword(s):  
Low Loss ◽  
Fine Pitch

Photolithography study for advanced packaging technologies

2016 ◽  
Author(s):  
Hiromi Suda ◽  
Masaki Mizutani ◽  
Shin-Ichiro Hirai ◽  
Ken-Ichiro Mori ◽  
Seiya Miura
Keyword(s):  
Advanced Packaging

Bonding process without pressure using a chestnut-burr-like particle paste for power electronics

2016 ◽  
Author(s):  
Myong-Hoon Roh ◽  
Hiroshi Nishikawa ◽  
Seiichiro Tsutsumi ◽  
Naruhiko Nishiwaki ◽  
Keiichi Ito ◽  
...  
Keyword(s):  
Power Electronics ◽  
Bonding Process
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