Study on coined solder bumps on micro-via PCBs

2002 ◽  
Author(s):  
Jae-Woong Nah ◽  
K.W. Paik ◽  
Won-Hoe Kim ◽  
Ki-Rok Hur
Keyword(s):  
Solder Bumps

The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages

2002 ◽  
Author(s):  
George F. Gaut
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Solder Bump ◽  
Selective Area ◽  
Fill Material ◽  
Solder Bumps ◽  
Time Required

Abstract Access to the solder bump and under-fill material of flip-chip devices has presented a new problem for failure analysts. The under-fill and solder bumps have also added a new source for failure causes. A new tool has become available that can reduce the time required to analyze this area of a flip-chip package. By using precision selective area milling it is possible to remove material (die or PCB) that will allow other tools to expose the source of the failure.

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

Digital holography with a set of two close wavelengths for height measurement of solder bumps

2020 ◽  
Vol 59 (SO) ◽  
pp. SOOE03
Author(s):  
Hiroyuki Ishigaki ◽  
Takahiro Mamiya ◽  
Yoshio Hayasaki
Keyword(s):  
Digital Holography ◽  
Height Measurement ◽  
Solder Bumps

scholarly journals Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab

2009 ◽  
Vol 4 (11) ◽  
pp. T11001-T11001
Author(s):  
E Skup ◽  
M Trimpl ◽  
R Yarema ◽  
J C Yun
Keyword(s):  
Flip Chip ◽  
Fine Pitch ◽  
Solder Bumps

Preparation of Sn—Ag—In ternary solder bumps by electroplating in sequence and reliability

2011 ◽  
Vol 32 (8) ◽  
pp. 083005 ◽  
Author(s):  
Dongliang Wang ◽  
Yuan Yuan ◽  
Le Luo
Keyword(s):  
Solder Bumps

scholarly journals Structural Modal Analysis for Detecting Open Solder Bumps on Flip Chips

2008 ◽  
Vol 31 (1) ◽  
pp. 118-126 ◽  
Author(s):  
D.S. Erdahl ◽  
M.S. Allen ◽  
I.C. Ume ◽  
J.H. Ginsberg
Keyword(s):  
Modal Analysis ◽  
Flip Chips ◽  
Solder Bumps

Solder Bumps Inspection UsingPrincipal Component Analysis in Active Thermography

2014 ◽  
Vol 912-914 ◽  
pp. 1529-1533
Author(s):  
Xiang Ning Lu ◽  
Ji Guang Han ◽  
Su Hua Han ◽  
Su Ya Wang ◽  
Ming Hui Shao
Keyword(s):  
Principal Component Analysis ◽  
Principal Component ◽  
Component Analysis ◽  
Source Distribution ◽  
Inspection System ◽  
Thermal Contrast ◽  
Ir Camera ◽  
Active Thermography ◽  
Solder Bumps ◽  
Pixel Value

A nondestructive inspection system has been developed using the active thermography technology. However the solder defects can not be distinguished directly from the thermal images captured by IR camera because of the heating non-uniformities. The principal component analysis is explored to identify the defects of the solder bumps accurately and effectively. Thermal contrast image is obtained by subtracting source distribution map from the original thermal image. The hot spots corresponding to 16 solder bumps are segmented. The pixels with the thermal contrast values ranging from 0.18°C to 0.20°C are counted, and the maximum and the minimum of the pixel value are found out respectively, which are used in the principal component analysis. The missing bump is identified by the first principal component score. The results show that it is effective using the principal component analysis in active thermography for defects inspection of solder bumps in microelectronic packaging.

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