ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)
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153

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Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012436 ◽

2003 ◽

Cited By ~ 3

Author(s):

V. Eveloy ◽

P. Rodgers ◽

J. Lohan

Keyword(s):

Thermal Behavior ◽

Electronic Component ◽

Experimental Measurements ◽

Numerical Predictions ◽

Transient Thermal

Cooling of electronic components with free jet impingement boiling

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012482 ◽

2003 ◽

Cited By ~ 1

Author(s):

A.A.O. Tay ◽

Hong Xue ◽

Cheng Yang

Keyword(s):

Jet Impingement ◽

Electronic Components ◽

Free Jet ◽

Jet Impingement Boiling

Micro heat pipes in low temperature cofire ceramic (LTCC) substrates

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012462 ◽

2003 ◽

Cited By ~ 4

Author(s):

W.K. Jones ◽

Y. Liu ◽

M. Gao

Keyword(s):

Low Temperature ◽

Heat Pipes ◽

Micro Heat Pipes

Thermal/fluid performance evaluation of serrated plate fin heat sinks

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012467 ◽

2003 ◽

Cited By ~ 2

Author(s):

I.K. Shwaish ◽

C.H. Amon ◽

J.Y. Murthy

Keyword(s):

Performance Evaluation ◽

Heat Sinks

High performance thermal vias in LTCC substrates

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012455 ◽

2003 ◽

Cited By ~ 16

Author(s):

M.A. Zampino ◽

R. Kandukuri ◽

W.K. Jones

Keyword(s):

High Performance

Numerical analysis of an array of ball grid components

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012439 ◽

2003 ◽

Author(s):

R. Cole ◽

M. Davies

Keyword(s):

Numerical Analysis

Convective boiling in microchannel heat sinks with spatially-varying heat generation

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012477 ◽

2003 ◽

Cited By ~ 3

Author(s):

Jae-Mo Koo ◽

Linan Jiang ◽

A. Bari ◽

L. Zhang ◽

E. Wang ◽

...

Keyword(s):

Heat Generation ◽

Heat Sinks ◽

Convective Boiling ◽

Microchannel Heat Sinks ◽

Spatially Varying

Thermal management for motor

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012503 ◽

2003 ◽

Author(s):

Ya-Chi Chen ◽

Chung-Lung Chen ◽

Qimin Dong ◽

R.W. Stephenson

Keyword(s):

Thermal Management

Silicon heat pipes used as thermal spreaders

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012574 ◽

2003 ◽

Cited By ~ 1

Author(s):

C. Gillot ◽

Y. Avenas ◽

N. Cezac ◽

G. Poupon ◽

C. Schaeffer ◽

...

Keyword(s):

Heat Pipes

Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012466 ◽

2003 ◽

Author(s):

Ho Chul Ryu ◽

Duckjong Kim ◽

Sung Jin Kim

Keyword(s):

Experimental Analysis ◽

Electronic Equipment ◽

Heat Sinks ◽

Pin Fin

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component

Cooling of electronic components with free jet impingement boiling

Micro heat pipes in low temperature cofire ceramic (LTCC) substrates

Thermal/fluid performance evaluation of serrated plate fin heat sinks

High performance thermal vias in LTCC substrates

Numerical analysis of an array of ball grid components

Convective boiling in microchannel heat sinks with spatially-varying heat generation

Thermal management for motor

Silicon heat pipes used as thermal spreaders

Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)
Latest Publications