Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247)
Latest Publications

TOTAL DOCUMENTS

89

(FIVE YEARS 0)

H-INDEX

7

(FIVE YEARS 0)

Published By IEEE

0780351746

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Managing the interconnect continuum...from silicon to package and board

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787061 ◽

2003 ◽

Author(s):

B. Siu

Download Full-text

High frequency modeling of interconnects in deep-submicron technologies

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787082 ◽

2003 ◽

Author(s):

C. Cregut ◽

G. Le Carval ◽

J. Chilo

Keyword(s):

High Frequency ◽

Download Full-text

A mechanism of stress-induced metal void in narrow aluminum-based metallization with the HDP CVD oxide dielectric

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787105 ◽

2003 ◽

Author(s):

Soo Geun Lee ◽

Heok-Sang Oh ◽

Sun-Rae Kim ◽

Seung-Heon Song ◽

Sun Hu Park ◽

...

Download Full-text

Scaling effect on electromigration in on-chip Cu wiring

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787140 ◽

2003 ◽

Author(s):

C.-K. Hu ◽

R. Rosenberg ◽

H.S. Rathore ◽

D.B. Nguyen ◽

B. Agarwala

Keyword(s):

Scaling Effect ◽

Download Full-text

High frequency simulation and characterization of advanced copper interconnects

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787127 ◽

2003 ◽

Author(s):

C. Cregut ◽

G. Le Carval ◽

J. Chilo

Keyword(s):

High Frequency ◽

Copper Interconnects

Download Full-text

Carbon-doped copper as a high-conductivity liner for copper/benzocyclobutene (BCB) interconnects

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787111 ◽

2003 ◽

Author(s):

J.M. Neirynck ◽

Y. Xiao ◽

R.J. Gutmann ◽

S.P. Murarka

Keyword(s):

High Conductivity ◽

Download Full-text

Comparative study of PE-BPSG and HDP-PSG as PMD for 0.25 μm memory device

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787070 ◽

2003 ◽

Author(s):

Jengyi Yu ◽

P. Gopalan ◽

J. Feng

Keyword(s):

Comparative Study ◽

Download Full-text

Overcoming sheet resistance effects to enable electroplating of copper onto seedless barrier films

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787144 ◽

2003 ◽

Author(s):

K.M. Takahashi

Keyword(s):

Sheet Resistance ◽

Download Full-text

Impact of interconnect architecture on chip size and die yield

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787066 ◽

2003 ◽

Author(s):

R. Liu ◽

C.-S. Pai ◽

H.-I. Cong ◽

W. Lai ◽

E. Martinez

Keyword(s):

Chip Size ◽

Download Full-text

The projected power consumption of a wireless clock distribution system and comparison to conventional distribution systems

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) ◽

10.1109/iitc.1999.787135 ◽

2003 ◽

Author(s):

B.A. Floyd ◽

K.K. O

Keyword(s):

Power Consumption ◽

Distribution System ◽

Distribution Systems ◽

Clock Distribution ◽

Download Full-text