Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.
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Lasers in electronics packaging

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298716 ◽

2003 ◽

Author(s):

Yunlong Sun ◽

E. Swenson

Keyword(s):

Electronics Packaging

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Comparison of isothermal mechanical fatigue properties of lead free solder joints and bulk solders

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298763 ◽

2003 ◽

Author(s):

C. Andersson ◽

Zonghe Lai ◽

Johan Liu ◽

Hairong Jiang ◽

Yongning Yu

Keyword(s):

Solder Joints ◽

Lead Free ◽

Fatigue Properties ◽

Lead Free Solder ◽

Mechanical Fatigue ◽

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Simulating optoelectronics/MEMS hermetic packaging process with finite element method

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298789 ◽

2003 ◽

Author(s):

Chinmoy Saha ◽

Daming Zhang ◽

Sheng Li

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Packaging Process ◽

Hermetic Packaging ◽

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Finite element stress analysis of thin die detachment process

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298691 ◽

2003 ◽

Author(s):

A.C.M. Chong ◽

Y.M. Cheung

Keyword(s):

Finite Element ◽

Stress Analysis ◽

Finite Element Stress Analysis ◽

Finite Element Stress

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Effect of Bi on the microstructure evolution of Sn-3Ag-0.5Cu/Cu solder joint

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298737 ◽

2003 ◽

Author(s):

Qi Lin ◽

Zhao Jie ◽

Wang Lai ◽

Han Shuangqi

Keyword(s):

Solder Joint ◽

Microstructure Evolution

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Rapid developmenting of electronic packaging industry of China

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298682 ◽

2003 ◽

Author(s):

Bi Keyun

Keyword(s):

Electronic Packaging ◽

Packaging Industry

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The effect of chemical species in the lead frame materials on the interface microstructure between copper alloys and SnPb solder

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298777 ◽

2003 ◽

Author(s):

Huang Fuxiang ◽

S.G. Hirowo ◽

Li Xiaoyan ◽

Ma Jusheng

Keyword(s):

Copper Alloys ◽

Chemical Species ◽

Interface Microstructure ◽

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New proposed adhesive tape application mechanism for stacking die applications

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298748 ◽

2003 ◽

Author(s):

Y.M. Cheung ◽

A.C.M. Chong

Keyword(s):

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The reason about causing the ceramic defect in the form of rolling

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298778 ◽

2003 ◽

Author(s):

Fan Zheng Liang ◽

Cheng Kai ◽

Tu Chuan Zheng ◽

Wang Lu Ning ◽

Zhu Jia Gen

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New anisotropic conductive film (ACF)

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298744 ◽

2003 ◽

Author(s):

A. Yokoyama ◽

K. Maehara ◽

K. Takagi

Keyword(s):

Anisotropic Conductive Film ◽

Conductive Film

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