Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.
Latest Publications

TOTAL DOCUMENTS

106

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H-INDEX

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Published By IEEE

0780381688

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effect of Bi on the microstructure evolution of Sn-3Ag-0.5Cu/Cu solder joint

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298737 ◽

2003 ◽

Author(s):

Qi Lin ◽

Zhao Jie ◽

Wang Lai ◽

Han Shuangqi

Keyword(s):

Solder Joint ◽

Microstructure Evolution

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Rapid developmenting of electronic packaging industry of China

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298682 ◽

2003 ◽

Author(s):

Bi Keyun

Keyword(s):

Electronic Packaging ◽

Packaging Industry

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Finite element stress analysis of thin die detachment process

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298691 ◽

2003 ◽

Cited By ~ 11

Author(s):

A.C.M. Chong ◽

Y.M. Cheung

Keyword(s):

Finite Element ◽

Stress Analysis ◽

Finite Element Stress Analysis ◽

Finite Element Stress

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Lasers in electronics packaging

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298716 ◽

2003 ◽

Cited By ~ 1

Author(s):

Yunlong Sun ◽

E. Swenson

Keyword(s):

Electronics Packaging

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Comparison of isothermal mechanical fatigue properties of lead free solder joints and bulk solders

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298763 ◽

2003 ◽

Cited By ~ 1

Author(s):

C. Andersson ◽

Zonghe Lai ◽

Johan Liu ◽

Hairong Jiang ◽

Yongning Yu

Keyword(s):

Solder Joints ◽

Lead Free ◽

Fatigue Properties ◽

Lead Free Solder ◽

Mechanical Fatigue ◽

Free Solder

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Simulating optoelectronics/MEMS hermetic packaging process with finite element method

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298789 ◽

2003 ◽

Author(s):

Chinmoy Saha ◽

Daming Zhang ◽

Sheng Li

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Packaging Process ◽

Hermetic Packaging ◽

Element Method

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The reason about causing the ceramic defect in the form of rolling

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298778 ◽

2003 ◽

Author(s):

Fan Zheng Liang ◽

Cheng Kai ◽

Tu Chuan Zheng ◽

Wang Lu Ning ◽

Zhu Jia Gen

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New anisotropic conductive film (ACF)

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298744 ◽

2003 ◽

Author(s):

A. Yokoyama ◽

K. Maehara ◽

K. Takagi

Keyword(s):

Anisotropic Conductive Film ◽

Conductive Film

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The effect of chemical species in the lead frame materials on the interface microstructure between copper alloys and SnPb solder

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298777 ◽

2003 ◽

Author(s):

Huang Fuxiang ◽

S.G. Hirowo ◽

Li Xiaoyan ◽

Ma Jusheng

Keyword(s):

Copper Alloys ◽

Chemical Species ◽

Interface Microstructure ◽

Lead Frame ◽

Snpb Solder

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New proposed adhesive tape application mechanism for stacking die applications

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. ◽

10.1109/eptc.2003.1298748 ◽

2003 ◽

Cited By ~ 11

Author(s):

Y.M. Cheung ◽

A.C.M. Chong

Keyword(s):

Adhesive Tape

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of Bi on the microstructure evolution of Sn-3Ag-0.5Cu/Cu solder joint

Rapid developmenting of electronic packaging industry of China

Finite element stress analysis of thin die detachment process

Lasers in electronics packaging

Comparison of isothermal mechanical fatigue properties of lead free solder joints and bulk solders

Simulating optoelectronics/MEMS hermetic packaging process with finite element method

The reason about causing the ceramic defect in the form of rolling

New anisotropic conductive film (ACF)

The effect of chemical species in the lead frame materials on the interface microstructure between copper alloys and SnPb solder

New proposed adhesive tape application mechanism for stacking die applications

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.
Latest Publications