2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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Published By IEEE

9781457712777, 9781457712760, 9781457712753

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Simulation of a wireless sensor network using OPNET

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102728 ◽

2011 ◽

Cited By ~ 12

Author(s):

C. Marghescu ◽

M. Pantazica ◽

A. Brodeala ◽

P. Svasta

Keyword(s):

Wireless Sensor Network ◽

Sensor Network ◽

Wireless Sensor

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Key-word data base used in communication system with disabled people

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102753 ◽

2011 ◽

Cited By ~ 3

Author(s):

Dana Anca Cehan ◽

Robert Lupu ◽

Vlad Cehan ◽

Radu Gabriel Bozomitu

Keyword(s):

Data Base ◽

Communication System ◽

Disabled People ◽

Key Word

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Lifetime prediction for components with scarce data: The “worst case” approach

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102742 ◽

2011 ◽

Author(s):

M. Bazu ◽

L. Galateanu ◽

V. E. Ilian ◽

D. Varsescu

Keyword(s):

Lifetime Prediction ◽

Worst Case ◽

Scarce Data

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Conductive mechanisms in electrical conductive adhesives with isotropical electrical conductivity

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102696 ◽

2011 ◽

Cited By ~ 1

Author(s):

Pavel Mach ◽

Jakub Cinert

Keyword(s):

Electrical Conductivity ◽

Conductive Adhesives

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HDR based steganographic algorithm

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102747 ◽

2011 ◽

Cited By ~ 1

Author(s):

Septimiu Fabian Mare ◽

Mircea Vladutiu ◽

Lucian Prodan

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Accelerated ageing tests for predicting capacitor lifetimes

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102687 ◽

2011 ◽

Cited By ~ 10

Author(s):

Rajmond Jano ◽

Dan Pitica

Keyword(s):

Accelerated Ageing

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Investigating the effect of nitrogen atmosphere on lead-free solder wetting angle

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102709 ◽

2011 ◽

Cited By ~ 3

Author(s):

Oliver Krammer ◽

Laszlo Puskas

Keyword(s):

Nitrogen Atmosphere ◽

Wetting Angle ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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Tin whisker growth from Sn-Cu (0–5 wt%) surface finishes

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102681 ◽

2011 ◽

Author(s):

Balazs Illes ◽

Tadashi Shinohara ◽

Barbara Horvath ◽

Gabor Harsanyi

Keyword(s):

Whisker Growth ◽

Tin Whisker ◽

Surface Finishes

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Investigating SIR of Cu, OSP, iSn and HASL surface finishes by THB test

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102749 ◽

2011 ◽

Author(s):

Balint Medgyes ◽

Balazs Illes

Keyword(s):

Surface Finishes

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High resolution video acquisition and transmission system, using DSP

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2011.6102734 ◽

2011 ◽

Author(s):

Paul Schiopu ◽

Bogdan Apetrechioaie ◽

Luminita Mateescu

Keyword(s):

High Resolution ◽

Transmission System ◽

Video Acquisition

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2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Simulation of a wireless sensor network using OPNET

Key-word data base used in communication system with disabled people

Lifetime prediction for components with scarce data: The “worst case” approach

Conductive mechanisms in electrical conductive adhesives with isotropical electrical conductivity

HDR based steganographic algorithm

Accelerated ageing tests for predicting capacitor lifetimes

Investigating the effect of nitrogen atmosphere on lead-free solder wetting angle

Tin whisker growth from Sn-Cu (0–5 wt%) surface finishes

Investigating SIR of Cu, OSP, iSn and HASL surface finishes by THB test

High resolution video acquisition and transmission system, using DSP

2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Latest Publications