Conductive mechanisms in electrical conductive adhesives with isotropical electrical conductivity

Author(s):  
Pavel Mach ◽  
Jakub Cinert
2016 ◽  
Vol 8 (35) ◽  
pp. 23244-23259 ◽  
Author(s):  
Elena Messina ◽  
Nancy Leone ◽  
Antonino Foti ◽  
Gaetano Di Marco ◽  
Cristina Riccucci ◽  
...  

2016 ◽  
Vol 5 (5) ◽  
pp. 300-308
Author(s):  
Masahiro INOUE ◽  
Yasukazu NIWAYAMA ◽  
Yoshiaki SAKANIWA ◽  
Yasunori TADA

1980 ◽  
Vol 7 (1-3) ◽  
pp. 69-75
Author(s):  
C. W. L. Kooring ◽  
D. Riphagen

The results of a study of the application of conductive adhesives for attaching semiconductor chips to thin film Au conductors is presented.The study concentrates on measuring the stability of the electrical conductivity of adhesive bonds for semiconductor chips.Four types of conductive bonding agents and two types of semiconductor back metallization were tested at raised temperatures for up to 10,000 hours.


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