2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Welcome Letter

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503244 ◽

2021 ◽

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Thermal Transport Study on Nanoslot-Patterned Thin Films

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503215 ◽

2021 ◽

Author(s):

Yue Xiao ◽

Qiyu Chen ◽

Qing Hao

Keyword(s):

Thin Films ◽

Thermal Transport ◽

Transport Study

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Conference Technical Program

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503198 ◽

2021 ◽

Keyword(s):

Technical Program

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Revisiting the optimal thickness profile of cooling fins: A one-dimensional analytical study using optimality conditions

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503196 ◽

2021 ◽

Author(s):

Joe Alexandersen ◽

Ole Sigmund

Keyword(s):

Optimality Conditions ◽

Analytical Study ◽

Optimal Thickness ◽

One Dimensional ◽

Thickness Profile

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Impact of Squeezing on the Microstructure of Thermal Interface Materials

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503232 ◽

2021 ◽

Author(s):

Rajath Kantharaj ◽

Carl Wassgren ◽

Aaron Morris ◽

Amy Marconnet

Keyword(s):

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

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Assessing the impact of novel polymers and thermal management in a power electronics module using machine learning approaches

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503255 ◽

2021 ◽

Author(s):

Palash V. Acharya ◽

Manojkumar Lokanathan ◽

Abdelhamid Ouroua ◽

Robert Hebner ◽

Shannon Strank ◽

...

Keyword(s):

Machine Learning ◽

Power Electronics ◽

Thermal Management ◽

Learning Approaches ◽

The Impact

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Optimization of PCM based Thermal Management Device for Power Electronics using an Effective Thermal Conductivity Model for architected enhancers

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503251 ◽

2021 ◽

Author(s):

Romain Hubert ◽

Olivier Bou-Matar ◽

Jerome Foncin ◽

Philippe Coquet ◽

Dunlin Tan ◽

...

Keyword(s):

Thermal Conductivity ◽

Effective Thermal Conductivity ◽

Power Electronics ◽

Thermal Management ◽

Conductivity Model ◽

Thermal Conductivity Model

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A Review on some Viscosity Models for CuO-water Nanofluid and their effects on Thermal Enhancement for Automotive Applications

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503208 ◽

2021 ◽

Author(s):

Eliel Welligton Marcelino ◽

Humberto N. Yoshimura

Keyword(s):

Automotive Applications ◽

Viscosity Models ◽

Thermal Enhancement

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Infrared Radiation Transparent Film Impact on Thermal Measurement

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503228 ◽

2021 ◽

Author(s):

Yuanchen Hu ◽

Milnes P. David ◽

John Madalengoitia

Keyword(s):

Infrared Radiation ◽

Transparent Film ◽

Thermal Measurement

Download Full-text

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Table of Contents

Welcome Letter

Thermal Transport Study on Nanoslot-Patterned Thin Films

Conference Technical Program

Revisiting the optimal thickness profile of cooling fins: A one-dimensional analytical study using optimality conditions

Impact of Squeezing on the Microstructure of Thermal Interface Materials

Assessing the impact of novel polymers and thermal management in a power electronics module using machine learning approaches

Optimization of PCM based Thermal Management Device for Power Electronics using an Effective Thermal Conductivity Model for architected enhancers

A Review on some Viscosity Models for CuO-water Nanofluid and their effects on Thermal Enhancement for Automotive Applications

Infrared Radiation Transparent Film Impact on Thermal Measurement

Export Citation Format

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Table of Contents

Welcome Letter

Thermal Transport Study on Nanoslot-Patterned Thin Films

Conference Technical Program

Revisiting the optimal thickness profile of cooling fins: A one-dimensional analytical study using optimality conditions

Impact of Squeezing on the Microstructure of Thermal Interface Materials

Assessing the impact of novel polymers and thermal management in a power electronics module using machine learning approaches

Optimization of PCM based Thermal Management Device for Power Electronics using an Effective Thermal Conductivity Model for architected enhancers

A Review on some Viscosity Models for CuO-water Nanofluid and their effects on Thermal Enhancement for Automotive Applications

Infrared Radiation Transparent Film Impact on Thermal Measurement

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
Latest Publications