2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Hardware Difficulties and Improvements for High Pressure Fuel Pump Solenoid Valve Noise Cancellation

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599265 ◽

2018 ◽

Author(s):

Laszlo Molnar ◽

Aurel Gontean

Keyword(s):

High Pressure ◽

Noise Cancellation ◽

Solenoid Valve ◽

Fuel Pump

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State of Charge and State of Health Estimation of Lithium-Ion Batteries

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599196 ◽

2018 ◽

Cited By ~ 3

Author(s):

Attila Buchman ◽

Claudiu Lung

Keyword(s):

Lithium Ion Batteries ◽

Lithium Ion ◽

State Of Charge ◽

State Of Health

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Performance Estimation of Scalable e-Learning Systems in the Cloud

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599252 ◽

2018 ◽

Author(s):

Strahil A. Sokolov ◽

Stefan M. Vlaev ◽

Mihail Vukadinoff ◽

Asen P. Zahariev ◽

Teodor B. Iliev ◽

...

Keyword(s):

Learning Systems ◽

Performance Estimation ◽

E Learning

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Considerations Regarding Computer Aided Design of a Structure to be Manufactured in Occam Technology

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599201 ◽

2018 ◽

Author(s):

Victoria Soare ◽

Gaudentiu Varzaru ◽

Adrian Zarnescu ◽

Razvan Ungurelu ◽

Ciprian Ionescu

Keyword(s):

Computer Aided Design ◽

Computer Aided ◽

Aided Design

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Thermal Characterization of Passive Cooling Techniques for High-Power Component Clusters

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599246 ◽

2018 ◽

Author(s):

A. Fodor ◽

R. Jano

Keyword(s):

High Power ◽

Thermal Characterization ◽

Passive Cooling ◽

Power Component

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White-Box Testing Strategy for a Solar Tracking Device Using NodeMCU Lua ESP8266 Wi-Fi Network Development Board Module

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599250 ◽

2018 ◽

Cited By ~ 1

Author(s):

Sorin Liviu Jurj ◽

Raul Rotar ◽

Flavius Opritoiu ◽

Mircea Vladutiu

Keyword(s):

Network Development ◽

Testing Strategy ◽

Solar Tracking ◽

White Box Testing ◽

Tracking Device

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Design and Evaluation of The Performance of a Special Solar Spectrum Simulator for Ruthenium-Based Dye Sensitized Solar Cell Testing Using LED Technology

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599226 ◽

2018 ◽

Cited By ~ 1

Author(s):

Ana Barar ◽

Marian Vladescu ◽

Paul Schiopu

Keyword(s):

Solar Cell ◽

Solar Spectrum ◽

Dye Sensitized Solar Cell ◽

Dye Sensitized ◽

Cell Testing

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Study of Alternative Solution for Aerial Photo Grammetry

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599229 ◽

2018 ◽

Author(s):

Sebastian Pop ◽

Arthur Nicolac ◽

Ilona Madalina Costea

Keyword(s):

Alternative Solution ◽

Aerial Photo

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Monitoring Walnut Orchards With LoRa Technology

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599217 ◽

2018 ◽

Author(s):

D.I. Sacaleanu ◽

I. K. Kiss

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Improving Practical Experience of Students in Preproduction and Production Stages of New Products

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2018.8599282 ◽

2018 ◽

Cited By ~ 2

Author(s):

Simeon Iliev ◽

Dancho Gunev ◽

Seher Kadirova ◽

Teodor Nenov ◽

Ivo Ivanov ◽

...

Keyword(s):

New Products ◽

Practical Experience ◽

Production Stages

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2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Hardware Difficulties and Improvements for High Pressure Fuel Pump Solenoid Valve Noise Cancellation

State of Charge and State of Health Estimation of Lithium-Ion Batteries

Performance Estimation of Scalable e-Learning Systems in the Cloud

Considerations Regarding Computer Aided Design of a Structure to be Manufactured in Occam Technology

Thermal Characterization of Passive Cooling Techniques for High-Power Component Clusters

White-Box Testing Strategy for a Solar Tracking Device Using NodeMCU Lua ESP8266 Wi-Fi Network Development Board Module

Design and Evaluation of The Performance of a Special Solar Spectrum Simulator for Ruthenium-Based Dye Sensitized Solar Cell Testing Using LED Technology

Study of Alternative Solution for Aerial Photo Grammetry

Monitoring Walnut Orchards With LoRa Technology

Improving Practical Experience of Students in Preproduction and Production Stages of New Products

Export Citation Format

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Hardware Difficulties and Improvements for High Pressure Fuel Pump Solenoid Valve Noise Cancellation

State of Charge and State of Health Estimation of Lithium-Ion Batteries

Performance Estimation of Scalable e-Learning Systems in the Cloud

Considerations Regarding Computer Aided Design of a Structure to be Manufactured in Occam Technology

Thermal Characterization of Passive Cooling Techniques for High-Power Component Clusters

White-Box Testing Strategy for a Solar Tracking Device Using NodeMCU Lua ESP8266 Wi-Fi Network Development Board Module

Design and Evaluation of The Performance of a Special Solar Spectrum Simulator for Ruthenium-Based Dye Sensitized Solar Cell Testing Using LED Technology

Study of Alternative Solution for Aerial Photo Grammetry

Monitoring Walnut Orchards With LoRa Technology

Improving Practical Experience of Students in Preproduction and Production Stages of New Products

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Latest Publications