10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)

2003 ◽

Author(s):

F. Leverd ◽

L. Loisil ◽

T. Lill ◽

J. Trevor ◽

P. Van Holt ◽

...

Keyword(s):

Gate Stack

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Capacity and cycle time-throughput understanding system (CAC-TUS) an analysis tool to determine the components of capacity and cycle time in a semiconductor manufacturing line

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798198 ◽

2003 ◽

Cited By ~ 12

Author(s):

D.P. Martin

Keyword(s):

Cycle Time ◽

Semiconductor Manufacturing ◽

Analysis Tool ◽

Manufacturing Line

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Implementing state of the art advanced process control and factory automation solutions at White Oak Semiconductor

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798192 ◽

2003 ◽

Author(s):

T. Urenda ◽

T. Dowd ◽

K. Dimond ◽

B. Schulze

Keyword(s):

Process Control ◽

State Of The Art ◽

White Oak ◽

Advanced Process Control ◽

Factory Automation

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Approaching the 35 nm technology node: technical requirements and key challenges in front-end processing

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798260 ◽

2003 ◽

Author(s):

R. Cleavelin

Keyword(s):

Technology Node ◽

Technical Requirements ◽

Front End

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Advanced interconnect process development utilizing wafer inspection with "on-the-fly" automatic defect classification

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798239 ◽

2003 ◽

Cited By ~ 2

Author(s):

A. Skumanich ◽

J. Boyle ◽

D. Brown

Keyword(s):

Process Development ◽

Defect Classification ◽

Wafer Inspection

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A new systematic yield ramp methodology

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798174 ◽

2003 ◽

Cited By ~ 7

Author(s):

K. Nemoto ◽

K. Walanabe ◽

M. Ono ◽

Y. Ikedaa ◽

K. Saiki

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A view to the future-a modular simulation kit for cost-efficient fab-wide planning and the simulation of automated material handling systems in the semiconductor industry

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798193 ◽

2003 ◽

Cited By ~ 2

Author(s):

U. Bader ◽

A. Besler ◽

J. Schliesser ◽

J. Dorner

Keyword(s):

Material Handling ◽

Semiconductor Industry ◽

Material Handling Systems ◽

The Future ◽

Automated Material Handling ◽

Automated Material Handling Systems ◽

Cost Efficient ◽

Modular Simulation

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Technological breakthrough in pad life improvement and its impact on CMP CoC

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798181 ◽

2003 ◽

Cited By ~ 1

Author(s):

S. Huey ◽

S.T. Mear ◽

Yuchun Wang ◽

R.R. Jin ◽

J. Ceresi ◽

...

Keyword(s):

Technological Breakthrough ◽

Life Improvement

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Two methods for improved accuracy calibration and control of ion implanter incidence angle

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798262 ◽

2003 ◽

Cited By ~ 1

Author(s):

R.D. Elzer ◽

P. Oakey ◽

J. Chen ◽

D. Sing

Keyword(s):

Incidence Angle ◽

And Control ◽

Improved Accuracy

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Interconnect constraints on BEOL manufacturing

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) ◽

10.1109/asmc.1999.798251 ◽

2003 ◽

Cited By ~ 4

Author(s):

R. Mangaser ◽

C. Mark ◽

K. Rose

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10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

WSi/sub x//poly-Si gate stack etching for advanced dRAM applications

Capacity and cycle time-throughput understanding system (CAC-TUS) an analysis tool to determine the components of capacity and cycle time in a semiconductor manufacturing line

Implementing state of the art advanced process control and factory automation solutions at White Oak Semiconductor

Approaching the 35 nm technology node: technical requirements and key challenges in front-end processing

Advanced interconnect process development utilizing wafer inspection with "on-the-fly" automatic defect classification

A new systematic yield ramp methodology

A view to the future-a modular simulation kit for cost-efficient fab-wide planning and the simulation of automated material handling systems in the semiconductor industry

Technological breakthrough in pad life improvement and its impact on CMP CoC

Two methods for improved accuracy calibration and control of ion implanter incidence angle

Interconnect constraints on BEOL manufacturing

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10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

WSi/sub x//poly-Si gate stack etching for advanced dRAM applications

Capacity and cycle time-throughput understanding system (CAC-TUS) an analysis tool to determine the components of capacity and cycle time in a semiconductor manufacturing line

Implementing state of the art advanced process control and factory automation solutions at White Oak Semiconductor

Approaching the 35 nm technology node: technical requirements and key challenges in front-end processing

Advanced interconnect process development utilizing wafer inspection with "on-the-fly" automatic defect classification

A new systematic yield ramp methodology

A view to the future-a modular simulation kit for cost-efficient fab-wide planning and the simulation of automated material handling systems in the semiconductor industry

Technological breakthrough in pad life improvement and its impact on CMP CoC

Two methods for improved accuracy calibration and control of ion implanter incidence angle

Interconnect constraints on BEOL manufacturing

10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)
Latest Publications