2011 International Symposium on Advanced Packaging Materials (APM)
Latest Publications

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Published By IEEE

9781467301497, 9781467301480

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Multipurpose quick 3D packaging process

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105718 ◽

2011 ◽

Author(s):

Zhao Yongrui ◽

Ma Hongbo ◽

Bi Minglu ◽

Huang Zhanwu ◽

Jia Jun ◽

...

Keyword(s):

Packaging Process ◽

3D Packaging

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Electromigration behavior of Cu-core/Sn-shell solder joints

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105724 ◽

2011 ◽

Author(s):

Wenkai Mu ◽

Wei Zhou ◽

Ping Wu

Keyword(s):

Solder Joints

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An optical glucose biosensor fabricated by encapsulating glucose oxidase in silica gel via sol-gel method

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105687 ◽

2011 ◽

Author(s):

Shuxian Chen ◽

Zhaoxian Xiong ◽

Helan Ye ◽

Xiaopeng Dong

Keyword(s):

Glucose Oxidase ◽

Silica Gel ◽

Sol Gel ◽

Glucose Biosensor ◽

Gel Method ◽

Sol Gel Method

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Study on interface of Pd-plated Cu wire stitch bonding

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105703 ◽

2011 ◽

Cited By ~ 1

Author(s):

Xingjie Liu ◽

Techun Wang ◽

Yuqi Cong ◽

Jiaji Wang

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20 Gigahertz noise suppressor based on ferromagnetic nanowire arrays

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105679 ◽

2011 ◽

Cited By ~ 4

Author(s):

Yanqiu Li ◽

Zheng Chen ◽

Liangliang Li ◽

James Cai

Keyword(s):

Nanowire Arrays ◽

Ferromagnetic Nanowire

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Board level thermal reliability modeling of POP assembling

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105716 ◽

2011 ◽

Cited By ~ 3

Author(s):

Chen Liu ◽

Yuanming Xiao ◽

Mingchun Zhang ◽

Lingfeng Shi ◽

Zhanwu Huang

Keyword(s):

Thermal Reliability ◽

Reliability Modeling ◽

Board Level

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Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEPIG pad after multiple reflows

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105717 ◽

2011 ◽

Cited By ~ 1

Author(s):

F. Yang ◽

L. W. Liu ◽

M. L. Huang

Keyword(s):

Comparative Study ◽

Interfacial Reactions ◽

Solder Balls

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Stress simulation for 2N gold wires and evaluation on the stitch bond shapes

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105722 ◽

2011 ◽

Cited By ~ 3

Author(s):

Weidong Huang ◽

Denis Bai ◽

Andy Luo

Keyword(s):

Gold Wires ◽

Stress Simulation

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Processing technology of embedded thin-film resistor materials

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105671 ◽

2011 ◽

Cited By ~ 2

Author(s):

Lifei Lai ◽

Rong Sun ◽

Tao Zhao ◽

XiaoLiang Zeng ◽

ShuHui Yu

Keyword(s):

Thin Film ◽

Processing Technology ◽

Film Resistor ◽

Thin Film Resistor

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The effect of two different latent curing agents on the performance of anisotropic conductive adhesives

2011 International Symposium on Advanced Packaging Materials (APM) ◽

10.1109/isapm.2011.6105751 ◽

2011 ◽

Author(s):

Bin Du ◽

Xionghui Cai ◽

Jiaqi Hu ◽

Ling Wang ◽

Hongqin Wang ◽

...

Keyword(s):

Conductive Adhesives ◽

Curing Agents

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2011 International Symposium on Advanced Packaging Materials (APM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Multipurpose quick 3D packaging process

Electromigration behavior of Cu-core/Sn-shell solder joints

An optical glucose biosensor fabricated by encapsulating glucose oxidase in silica gel via sol-gel method

Study on interface of Pd-plated Cu wire stitch bonding

20 Gigahertz noise suppressor based on ferromagnetic nanowire arrays

Board level thermal reliability modeling of POP assembling

Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEPIG pad after multiple reflows

Stress simulation for 2N gold wires and evaluation on the stitch bond shapes

Processing technology of embedded thin-film resistor materials

The effect of two different latent curing agents on the performance of anisotropic conductive adhesives

2011 International Symposium on Advanced Packaging Materials (APM)
Latest Publications