2011 International Symposium on Advanced Packaging Materials (APM)
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9781467301497, 9781467301480
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Multipurpose quick 3D packaging process

2011 ◽  
Author(s):  
Zhao Yongrui ◽  
Ma Hongbo ◽  
Bi Minglu ◽  
Huang Zhanwu ◽  
Jia Jun ◽  
...  
Keyword(s):  
Packaging Process ◽  
3D Packaging

Electromigration behavior of Cu-core/Sn-shell solder joints

2011 ◽  
Author(s):  
Wenkai Mu ◽  
Wei Zhou ◽  
Ping Wu
Keyword(s):  
Solder Joints

Study on interface of Pd-plated Cu wire stitch bonding

2011 ◽  
Author(s):  
Xingjie Liu ◽  
Techun Wang ◽  
Yuqi Cong ◽  
Jiaji Wang

20 Gigahertz noise suppressor based on ferromagnetic nanowire arrays

2011 ◽  
Author(s):  
Yanqiu Li ◽  
Zheng Chen ◽  
Liangliang Li ◽  
James Cai
Keyword(s):  
Nanowire Arrays ◽  
Ferromagnetic Nanowire

Board level thermal reliability modeling of POP assembling

2011 ◽  
Author(s):  
Chen Liu ◽  
Yuanming Xiao ◽  
Mingchun Zhang ◽  
Lingfeng Shi ◽  
Zhanwu Huang
Keyword(s):  
Thermal Reliability ◽  
Reliability Modeling ◽  
Board Level

Processing technology of embedded thin-film resistor materials

2011 ◽  
Author(s):  
Lifei Lai ◽  
Rong Sun ◽  
Tao Zhao ◽  
XiaoLiang Zeng ◽  
ShuHui Yu
Keyword(s):  
Thin Film ◽  
Processing Technology ◽  
Film Resistor ◽  
Thin Film Resistor

The effect of two different latent curing agents on the performance of anisotropic conductive adhesives

2011 ◽  
Author(s):  
Bin Du ◽  
Xionghui Cai ◽  
Jiaqi Hu ◽  
Ling Wang ◽  
Hongqin Wang ◽  
...  
Keyword(s):  
Conductive Adhesives ◽  
Curing Agents
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