2005 6th International Conference on Electronic Packaging Technology
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148
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0780394496
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Novel fluorinated polyimides for microelectronics applications

2006 ◽  
Author(s):  
Z.Y. Ge ◽  
D.X. Yin ◽  
J.G. Liu ◽  
L. Fan ◽  
S.Y. Yang
Keyword(s):  
Fluorinated Polyimides

Packaging and performance of 980nm broad area semiconductor lasers

2006 ◽  
Author(s):  
X. Liu ◽  
L.C. Hughes ◽  
M.H. Rasmussen ◽  
M.H. Hu ◽  
V.A. Bhagavatula ◽  
...  
Keyword(s):  
Semiconductor Lasers ◽  
Broad Area ◽  
And Performance

A study of thermosonic gold wire bonding onto silver plated copper pad

2006 ◽  
Author(s):  
Wu Fengshun ◽  
Hu Yanxiang ◽  
Wu Yiping ◽  
An Bing ◽  
Zhang Jinsong
Keyword(s):  
Gold Wire ◽  
Wire Bonding

300mm low k wafer dicing saw study

2006 ◽  
Author(s):  
Wang ZhiJie ◽  
S. Wang ◽  
J.H. Wang ◽  
S. Lee ◽  
Yao Su Ying ◽  
...  
Keyword(s):  
Low K
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