2005 6th International Conference on Electronic Packaging Technology
Latest Publications

TOTAL DOCUMENTS

148

(FIVE YEARS 0)

H-INDEX

8

(FIVE YEARS 0)

Published By IEEE

0780394496

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Packaging and performance of 980nm broad area semiconductor lasers

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564731 ◽

2006 ◽

Author(s):

X. Liu ◽

L.C. Hughes ◽

M.H. Rasmussen ◽

M.H. Hu ◽

V.A. Bhagavatula ◽

...

Keyword(s):

Semiconductor Lasers ◽

And Performance

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Novel fluorinated polyimides for microelectronics applications

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564726 ◽

2006 ◽

Author(s):

Z.Y. Ge ◽

D.X. Yin ◽

J.G. Liu ◽

L. Fan ◽

S.Y. Yang

Keyword(s):

Fluorinated Polyimides

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Prediction of Delamination in Micro-electronic Packages

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564624 ◽

2006 ◽

Author(s):

W.D. van Driel ◽

M.A.J. van Gils ◽

G.Q. Zhang

Keyword(s):

Electronic Packages

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The impact of zincation on the electroless nickel UBM for low cost flip chip technology

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564662 ◽

2006 ◽

Author(s):

Yu Yang ◽

Jian Cai ◽

Shuidi Wang ◽

Songliang Jia

Keyword(s):

Flip Chip ◽

Low Cost ◽

Electroless Nickel ◽

Chip Technology ◽

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300mm low k wafer dicing saw study

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564687 ◽

2006 ◽

Author(s):

Wang ZhiJie ◽

S. Wang ◽

J.H. Wang ◽

S. Lee ◽

Yao Su Ying ◽

...

Keyword(s):

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Studies on fabrication of high density MCM-D substrate by aluminum anodization techniques

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564709 ◽

2006 ◽

Author(s):

Dapeng Zhu ◽

Lichun Wang ◽

Yingjun Cheng ◽

Gaowei Xu ◽

Le Luo

Keyword(s):

High Density ◽

Aluminum Anodization

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Micromachined Packaging for Ultrasonic Transducers with Particle Restraint Mechanisms

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564684 ◽

2006 ◽

Author(s):

Hsing-Cheng Chang ◽

Chi-Chih Lai ◽

Hsien-Hui Tseng ◽

Yen-Ju Chen

Keyword(s):

Ultrasonic Transducers

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Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564691 ◽

2006 ◽

Author(s):

Lixi Wan ◽

P. Markondeya Raj ◽

M. Swaminathan ◽

R. Tummala

Keyword(s):

Measurement Techniques ◽

Decoupling Capacitors

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Parametric cost estimating: a practical independent method of estimating the manufacturing cost of chips to modules in the Peoples Republic of China

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564614 ◽

2006 ◽

Author(s):

R.W. Farrington

Keyword(s):

Independent Method ◽

Manufacturing Cost ◽

Cost Estimating ◽

Republic Of China

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A study of thermosonic gold wire bonding onto silver plated copper pad

2005 6th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2005.1564658 ◽

2006 ◽

Author(s):

Wu Fengshun ◽

Hu Yanxiang ◽

Wu Yiping ◽

An Bing ◽

Zhang Jinsong

Keyword(s):

Gold Wire ◽

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