Bonding process using microscale Ag particle paste for die attach

2016 ◽  
Author(s):  
H. Nishikawa ◽  
X. Liu ◽  
X. Wang ◽  
A. Fujita ◽  
N. Kamada ◽  
...  
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Ag Particle

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

An Innovative High Thermal Conductive Solderable Adhesive

2011 ◽  
Vol 2011 (1) ◽  
pp. 000852-000856
Author(s):  
Mary Liu ◽  
Wusheng Yin
Keyword(s):  
High Power ◽  
Low Cost ◽  
Bonding Process ◽  
Advanced Materials ◽  
Reflow Process ◽  
Power Devices ◽  
Process Yield ◽  
Thermal Compression ◽  
Soldering Temperature ◽  
Die Attach

With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320 °C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230 °C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.

The evaluation of copper migration during the die attach curing and second wire bonding process

2005 ◽  
Vol 28 (2) ◽  
pp. 337-344 ◽  
Author(s):  
T.Y. Lin ◽  
M.G. Pecht ◽  
D. Das ◽  
Jisheng Pan ◽  
Zhu Wenhui
Keyword(s):  
Wire Bonding ◽  
Bonding Process ◽  
Die Attach

Optical Probes and Electrical Resistivity Measurements of Conductive Die Attach Adhesives

1998 ◽  
Vol 515 ◽  
Author(s):  
Joseph Miragliotta ◽  
Richard C. Benson ◽  
Terry E. Phillips ◽  
John A. Emerson
Keyword(s):  
Electrical Conductivity ◽  
Electrical Resistivity ◽  
Polymer Composite ◽  
Amorphous Carbon ◽  
Carbon Layer ◽  
Curing Temperature ◽  
Temperature Threshold ◽  
Die Attach ◽  
Ag Particle ◽  
Amorphous Carbon Layer

ABSTRACTAn important phenomenon in silver (Ag) particle-filled adhesives is the development of electrical conductivity as the polymer composite is cured. We report the results of optical and electrical measurements performed on a commercially available Ag particle/polymer composite as a function of sample temperature. Surface enhanced Raman scattering (SERS) was used to probe the chemical nature of the Ag interface while a four-point contact probe monitored the onset of DC electrical conductivity. Complementary to the die attach adhesives studies, SERS experiments were also performed on commercially available neat Ag flake with controlled adsorbate coverages. For both the neat flake and filled adhesive, a carboxylate layer was attached to an oxygen-covered Ag flake surface via the carboxylic acid end of the molecule. The SERS results observed a partial decomposition of the carboxylate species into an amorphous carbon layer upon an increase in the temperature of both the flake and filled adhesive samples. However, the temperature threshold for the chemical conversion was lower for the Ag-filled adhesive relative to the neat flake. In the composite samples, the formation of the amorphous carbon layer occurred well below the curing temperature and coincided with a corresponding decrease in the electrical resistivity of the adhesive. Thus, an initial step in developing electrical conductivity appears to be the partial conversion of the lubricant adsorbate to an amorphous carbon layer.

scholarly journals Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000084-000090 ◽  
Author(s):  
Cyril Buttay ◽  
Amandine Masson ◽  
Jianfeng Li ◽  
Mark Johnson ◽  
Mihai Lazar ◽  
...  
Keyword(s):  
Operating Temperature ◽  
Bonding Process ◽  
Attractive Alternative ◽  
Special Focus ◽  
Process Optimisation ◽  
Melting Points ◽  
Power Devices ◽  
Die Attach ◽  
Silver Sintering ◽  
Soldering Alloys

Silver sintering is becoming an attractive alternative to soldering, especially for high temperature applications. Indeed, the increase in operating temperature requires new soldering alloys with even higher melting points. Silver sintering, on the contrary, is a solution which only require moderate (<300°C) process temperature. In this paper, we present the implementation of a die attach technique based on sintering of some silver paste, with a special focus on the practical considerations. A good quality bond can be achieved by paying attention to the assembly process.

Optimizing the performance of the Au-Si system for high temperature die attach applications

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000068-000076 ◽  
Author(s):  
M.F. Sousa ◽  
S. Riches ◽  
C. Johnston ◽  
P.S. Grant
Keyword(s):  
High Temperature ◽  
Thermal Stresses ◽  
Microstructural Analysis ◽  
Thin Foil ◽  
Bonding Process ◽  
Acoustic Microscopy ◽  
Harsh Environments ◽  
Potential Candidate ◽  
Die Attach ◽  
Die Bonding

The operation of electronic packages under exceptionally harsh environments presents a significant challenge for the microelectronics industry, for example, in down-hole, well-logging and turbo-machinery applications. High temperature Au based solders are one potential candidate for die attachment for harsh environments and is already used in limited cases. For Au-Si die bonding, some of the Si is provided by diffusion from the Si die itself. Therefore, the interfacial reaction between the Si and Au-Si thin foil solder preform is a key factor in the control of the die bonding process. Unfortunately, during the die bonding process, defects such as voids, delaminations, and impurities are not unusual. These defects are caused by the assembly process, chemical impurities, soldering reactions, and thermal stresses. Understanding these defects is critical for the reliable performance of the devices after bonding. In this paper, optimization of the Au-Si eutectic die bonding has been performed and near 100% bonded area confirmed by scanning acoustic microscopy achieved consistently. Die attach reliability was investigated by thermal shock and thermal cycling treatments, after which the bonded area showed some signs of degradation. Shear strength testing and microstructural analysis were also carried out. Die bond optimisation gave a significant improvement in both bonded area and reliability.

Hepatitis A Antigen in Liver, Bile and Stool

1975 ◽  
Vol 33 ◽  
pp. 340-341
Author(s):  
D.R. Jackson ◽  
J.H. Hoofnagle ◽  
A.N. Schulman ◽  
J.L. Dienstag ◽  
R.H. Purcell ◽  
...  
Keyword(s):  
Hepatitis A ◽  
Liver Enzymes ◽  
Hepatitis A Virus ◽  
Type A ◽  
Initial Study ◽  
Virus Like Particle ◽  
Elevated Liver Enzymes ◽  
Ag Particles ◽  
Ag Particle ◽  
Human Stool

Using immune electron microscopy Feinstone et. al. demonstrated the presence of a 27 nm virus-like particle in acute-phase stools of patients with viral hepatitis, type A, These hepatitis A antigen (HA Ag) particles were aggregated by convalescent serum from patients with type A hepatitis but not by pre-infection serum. Subsequently Dienstag et. al. and Maynard et. al. produced acute hepatitis in chimpanzees by inoculation with human stool containing HA Ag. During the early acute disease, virus like particles antigenically, morphologically and biophysically identical to the human HA Ag particle were found in chimpanzee stool. Recently Hilleman et. al. have described similar particles in liver and serum of marmosets infected with hepatitis A virus (HAV). We have investigated liver, bile and stool from chimpanzees and marmosets experimentally infected with HAV. In an initial study, a chimpanzee (no.785) inoculated with HA Ag-containing stool developed elevated liver enzymes 21 days after exposure.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

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