Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)
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Composite Materials for Electronic Packaging and Thermal Management

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762420 ◽

2005 ◽

Author(s):

C. Zweben

Keyword(s):

Composite Materials ◽

Thermal Management ◽

Electronic Packaging

Measurement and simulation of junction to board thermal resistance and its application in thermal modeling

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762450 ◽

2003 ◽

Cited By ~ 11

Author(s):

B. Joiner ◽

V. Adams

Keyword(s):

Thermal Resistance ◽

Thermal Modeling

Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762421 ◽

2003 ◽

Cited By ~ 16

Author(s):

R.C. Chu ◽

R.E. Simons ◽

G.M. Chrysler

Keyword(s):

Experimental Investigation ◽

High Performance

Active thermal spreader with solid coolant

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762423 ◽

2003 ◽

Author(s):

J.S. Batchelder

Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762449 ◽

2003 ◽

Cited By ~ 26

Author(s):

H. Pape ◽

G. Noebauer

Keyword(s):

Active Components ◽

Thermal Models

Thermal modeling of diamond-based power electronics packaging

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762434 ◽

2003 ◽

Cited By ~ 23

Author(s):

P.M. Fabis ◽

D. Shum ◽

H. Windischmann

Keyword(s):

Power Electronics ◽

Thermal Modeling ◽

Electronics Packaging

Thermal performance of single- and joint-extrusions with discrete heat sources

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762430 ◽

2003 ◽

Author(s):

B.S. Lall

Keyword(s):

Thermal Performance ◽

Heat Sources ◽

Discrete Heat Sources

A review of IBM sponsored research and development projects for computer cooling

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762443 ◽

2003 ◽

Cited By ~ 2

Author(s):

R.C. Chu

Keyword(s):

Research And Development ◽

Development Projects ◽

A computational study of two phase jet impingement cooling of an electronic chip

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762422 ◽

2003 ◽

Cited By ~ 3

Author(s):

D. Wang ◽

E. Yu ◽

A. Przekwas

Keyword(s):

Computational Study ◽

Jet Impingement ◽

Two Phase ◽

Impingement Cooling

Junction-to-top and junction-to-board thermal resistance measurement for 119 BGA packages

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) ◽

10.1109/stherm.1999.762441 ◽

2003 ◽

Cited By ~ 3

Author(s):

T. Chung ◽

M. Kim ◽

J. Baek ◽

S. Oh

Keyword(s):

Thermal Resistance ◽

Resistance Measurement ◽

Bga Packages

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Composite Materials for Electronic Packaging and Thermal Management

Measurement and simulation of junction to board thermal resistance and its application in thermal modeling

Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module

Active thermal spreader with solid coolant

Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods

Thermal modeling of diamond-based power electronics packaging

Thermal performance of single- and joint-extrusions with discrete heat sources

A review of IBM sponsored research and development projects for computer cooling

A computational study of two phase jet impingement cooling of an electronic chip

Junction-to-top and junction-to-board thermal resistance measurement for 119 BGA packages

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)
Latest Publications