Materials for Advanced Packaging
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22
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Published By Springer International Publishing

9783319450971, 9783319450988
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thin Die Fabrication and Applications to Wafer Level System Integration

2016 ◽  
pp. 237-285 ◽  
Author(s):  
Doug C. H. Yu ◽  
Wen-Chih Chiou ◽  
Chih Hang Tung
Keyword(s):  
System Integration ◽  
Level System ◽  
Wafer Level

Advanced Bonding Technology Based on Nano- and Micro-metal Pastes

2016 ◽  
pp. 589-626 ◽  
Author(s):  
Katsuaki Suganuma ◽  
Jinting Jiu
Keyword(s):  
Bonding Technology

Wafer Level Chip Scale Packaging

2016 ◽  
pp. 627-695 ◽  
Author(s):  
Michael Töpper
Keyword(s):  
Wafer Level

Characterization of Copper Diffusion in Through Silicon Vias

2016 ◽  
pp. 923-951
Author(s):  
Xiaodong Zhang ◽  
Shi-Wei Ricky Lee ◽  
Fuliang Le
Keyword(s):  
Through Silicon Vias ◽  
Copper Diffusion ◽  
Silicon Vias

Embedded Passives

2016 ◽  
pp. 537-588 ◽  
Author(s):  
Pulugurtha Markondeya Raj ◽  
Dok Won Lee ◽  
Liangliang Li ◽  
Shan Xiang Wang ◽  
Parthasarathi Chakraborti ◽  
...  
Keyword(s):  
Embedded Passives

Thermal Interface Materials

2016 ◽  
pp. 511-535 ◽  
Author(s):  
Ravi Prasher ◽  
Chia-Pin Chiu
Keyword(s):  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

LED Die Bonding

2016 ◽  
pp. 733-766
Author(s):  
Yu-Chou Shih ◽  
Gunwoo Kim ◽  
Jiun-Pyng You ◽  
Frank G. Shi
Keyword(s):  
Die Bonding

Flip-Chip Underfill: Materials, Process, and Reliability

2016 ◽  
pp. 331-371 ◽  
Author(s):  
Zhuqing Zhang ◽  
Pengli Zhu ◽  
C. P. Wong
Keyword(s):  
Flip Chip
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