2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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9784904743034
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effects of electromagnetic radiation exposure on direct Cu bonding

2017 ◽  
Author(s):  
Jenn-Ming Song ◽  
Sin-Yong Liang ◽  
Po-Hao Chiang ◽  
Shang-Kun Huang ◽  
Ying-Ta Chiu ◽  
...  
Keyword(s):  
Electromagnetic Radiation ◽  
Radiation Exposure ◽  
Cu Bonding

scholarly journals Al-Al wafer-level thermocompression bonding applied for MEMS

2017 ◽  
Author(s):  
M.M. Visser Taklo ◽  
K. Schjolberg-Henriksen ◽  
N. Malik ◽  
E. Poppe ◽  
S.T. Moe ◽  
...  
Keyword(s):  
Wafer Level ◽  
Thermocompression Bonding

Low temperature Cu/In bonding for 3D integration

2017 ◽  
Author(s):  
Iuliana Panchenko ◽  
Steffen Bickel ◽  
Jorg Meyer ◽  
Maik Muller ◽  
Jurgen M. Wolf
Keyword(s):  
Low Temperature ◽  
3D Integration
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