scholarly journals Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

2017 ◽  
Author(s):  
Sophia Dempwolf ◽  
Lutz Hofmann ◽  
Christopher Bowers ◽  
Daniela Guenther ◽  
Roy Knechtel ◽  
...  
Keyword(s):  
System Integration ◽  
Heterogeneous System ◽  
Wafer Level ◽  
Mems Sensors ◽  
Wafer Level Packaging

Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-23 ◽  
Author(s):  
Steffen Kroehnert ◽  
André Cardoso ◽  
Steffen Kroehnert ◽  
Raquel Pinto ◽  
Elisabete Fernandes ◽  
...  
Keyword(s):  
System Integration ◽  
Low Cost ◽  
High Volume ◽  
Building Blocks ◽  
Dielectric Materials ◽  
Wafer Level ◽  
Mems Sensors ◽  
Packaging Technology ◽  
Wafer Level Packaging ◽  
Dense System

The Internet of Things/ Everything (IoT/E) will require billions of single or multiple MEMS/Sensors integrated in modules together with other functional building blocks like processor, memory, connectivity, built-in security, power management, energy harvesting, and battery charging. The success of IoT/E will also depend on the selection of the right Packaging Technology. The winner will be the one achieving the following key targets: best electrical and thermal system performance, miniaturization by dense system integration, effective MEMS/Sensors fusion into the systems, manufacturability in high volume at low cost. MEMS/Sensors packaging in low cost molded packages on large manufacturing formats has always been a challenge, whether because of the parameter drift of the sensors caused by the packaging itself or, as in many cases, the molded packaging technology is not compatible to the way MEMS/Sensors are working. Wafer-Level Packaging (WLP), namely Fan-Out WLP (FOWLP) technologies such as eWLB, WLFO, RCP, M-Series and InFO are showing good potential to meet those requirements and offer the envisioned system solutions. FOWLP will grow with CAGR between 50–80% until 2020, forecasted by the leading market research companies in this field. System integration solutions (WLSiP and WL3D) will dominate FOWLP volumes in the future compared to current single die FOWLP packages for mobile communication. The base technology is available and has proven maturity in high volume production, but for dense system integration of MEMS/Sensors, additional advanced building blocks need to be developed and qualified to extend the technology platform. The status and most recent developments on NANIUM's WLFO technology, which is based on Infineon's/Intel's eWLB technology, aiming to overcome the current limits for MEMS/Sensors integration, will be presented in this paper. This will cover the processing of Keep-Out Zones (KOZ) for MEMS/Sensors access to environment in molded wafer-level packages, mold stress relief on dies for MEMS/Sensors die decoupling from internal package stress, thin-film shielding using PVD seed layer as functional layer, and heterogeneous dielectrics stacking, in which different dielectric materials fulfill different functions in the package, including the ability to integrate Microfluidic.

Assembly and Packaging Enabling System Integration

2013 ◽  
Vol 2013 (1) ◽  
pp. 000171-000176 ◽  
Author(s):  
Klaus Pressel ◽  
Gottfried Beer ◽  
Maciej Wojnowski
Keyword(s):  
Energy Efficiency ◽  
Silicon Wafer ◽  
System Integration ◽  
Ball Grid Array ◽  
Mobile Systems ◽  
Heterogeneous Integration ◽  
Wafer Level ◽  
Nanoelectronic Devices ◽  
Wafer Level Packaging ◽  
Major Trend

More than Moore is a major trend to tackle the increasing difficulties of traditional Moore's law scaling. System in Package technologies, which allow heterogeneous integration, are appearing in ever more electronic applications. Furthermore we observe merging of silicon wafer technology with assembly and packaging technologies. Today a more coherent development taking into account chip, package, and the board is needed. In this paper we show how assembly and packaging can take up the slack because traditional More Moore downscaling is becoming more difficult. First, we introduce the Thin Small Leadless Package (TSLP) e.g. used in mobile systems. The TSLP is similar to the Quad Flat No-Lead (QFN) package, but thinner and with less parasitics. Second, we introduce wafer level type packages. The limits of standard wafer level packaging in respect to I/O counts pushed the development of the embedded Wafer Level Ball Grid Array (eWLB). We demonstrate the outstanding system integration capabilities of the eWLB including excellent mm-wave performance. For all the above mentioned packages chip and package technologies merge. They are door opener for nanoelectronic devices in respect to energy efficiency, mobility and security.

High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

2012 ◽  
Author(s):  
Christianto C. Liu ◽  
Shuo-Mao Chen ◽  
Feng-Wei Kuo ◽  
Huan-Neng Chen ◽  
En-Hsiang Yeh ◽  
...  
Keyword(s):  
System Integration ◽  
High Performance ◽  
Wafer Level ◽  
Wafer Level Packaging

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 ◽  
Author(s):  
A. Orozco ◽  
N.E. Gagliolo ◽  
C. Rowlett ◽  
E. Wong ◽  
A. Moghe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Fault Isolation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Current Location ◽  
Geometrical Information ◽  
Magnetic Field Imaging ◽  
Silicon Vias ◽  
Non Destructive ◽  
Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

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