Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195)
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The Use of Spreadsheets in Packaging Thermal Calculations

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660387 ◽

2005 ◽

Author(s):

B.M. Guenin

Keyword(s):

Thermal Calculations

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Transient Adaptive Thermal Simulation of Microwave Integrated Circuits

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660380 ◽

2005 ◽

Author(s):

J.S. Wilson ◽

P.E. Raad ◽

D.C. Price

Keyword(s):

Integrated Circuits ◽

Thermal Simulation ◽

Microwave Integrated Circuits

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Development of cost-effective high power 208HTQFP

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660400 ◽

2002 ◽

Author(s):

S.K. Mok ◽

D.S. Chung ◽

T.G. Chung ◽

S.Y. Oh

Keyword(s):

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The effect of a table on the thermal performance of an electronic system

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660382 ◽

2002 ◽

Author(s):

S. Neelakantan ◽

S. Addison

Keyword(s):

Thermal Performance ◽

Electronic System

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An experimental thermal characterization of a 272 PBGA within an automotive engine controller module

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660386 ◽

2002 ◽

Author(s):

C.E. Triplett ◽

B. Joiner

Keyword(s):

Thermal Characterization ◽

Automotive Engine

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Steady state thermal characterization of multiple output devices using linear superposition theory and a non-linear matrix multiplier

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660385 ◽

2002 ◽

Author(s):

B.A. Zahn

Keyword(s):

Steady State ◽

Thermal Characterization ◽

Linear Matrix ◽

Linear Superposition ◽

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Ball-grid-array package thermal management

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660391 ◽

2002 ◽

Author(s):

K. Chung

Keyword(s):

Thermal Management ◽

Ball Grid Array ◽

Ball Grid Array Package

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Concurrent thermal design for high-power electronics

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660393 ◽

2002 ◽

Author(s):

B.S. Lall

Keyword(s):

Power Electronics ◽

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Thermal performance of tape based ball grid array over molded packages

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660403 ◽

2002 ◽

Author(s):

D. Edwards ◽

P. Hundt

Keyword(s):

Thermal Performance ◽

Ball Grid Array

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Thermal study of additive multilayer circuitry on polymer and metal substrates

Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) ◽

10.1109/stherm.1998.660394 ◽

2002 ◽

Author(s):

L. Ha ◽

G. Matijasevic ◽

P. Gandhi ◽

C. Gallagher ◽

C.C. Lee

Keyword(s):

Thermal Study ◽

Metal Substrates

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