Silicon Nitride Tensile Strength Database from CTP Processing for Reliability Project

2008 ◽  
pp. 303-303
Author(s):  
Michael R. Foley ◽  
Vimal K. Pujari ◽  
Lenny C. Sales ◽  
Dennis M. Tracey
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
Strength Database

Processing Methods for High Reliability Silicon Nitride Heat Engine Components

1995 ◽  
Vol 117 (1) ◽  
pp. 156-160 ◽  
Author(s):  
V. K. Pujari ◽  
D. M. Tracey
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
Process Control ◽  
High Reliability ◽  
Heat Engine ◽  
High Strength ◽  
Processing Unit ◽  
Unit Operations ◽  
Engine Components ◽  
Strength Database

The paper discusses highlights of a silicon nitride processing methodology that has been developed in the course of a major four-year DoE funded program in processing for reliability. The program focused on the attainment of high strength and reliability through the identification and subsequent control of strength-degrading flaws introduced during processing unit operations. Process control and NDE methods applied to achieve an optimized process with the potential to produce high-reliability advanced heat engine components are discussed. Concluding remarks are directed to the extensive tensile strength database that has been generated through testing of over 300 tensile rods produced by the optimized process.

scholarly journals Processing Methods for High Reliability Silicon Nitride Heat Engine Components

1993 ◽  
Author(s):  
Vimal K. Pujari ◽  
Dennis M. Tracey
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
Process Control ◽  
High Reliability ◽  
Heat Engine ◽  
High Strength ◽  
Processing Unit ◽  
Unit Operations ◽  
Engine Components ◽  
Strength Database

The paper discusses highlights of a silicon nitride processing methodology that has been developed in the course of a major four year DoE funded program in processing for reliability. The program focused on the attainment of high strength and reliability through the identification and subsequent control of strength degrading flaws introduced during processing unit operations. Process control and NDE methods applied to achieve an optimized process with the potential to produce high reliability advanced heat engine components are discussed. Concluding remarks are directed to the extensive tensile strength database that has been generated through testing of over 300 tensile rods produced by the optimized process.

Anab initiocalculation of the ideal tensile strength of β-silicon nitride

2001 ◽  
Vol 64 (17) ◽  
Author(s):  
Shigenobu Ogata ◽  
Naoto Hirosaki ◽  
Cenk Kocer ◽  
Hiroshi Kitagawa
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
The Ideal

scholarly journals Tensile Strength of Hot Isostatic Pressed Silicon Nitride and Effect of Specimen Dimension.

1991 ◽  
Vol 57 (539) ◽  
pp. 1637-1642 ◽  
Author(s):  
Shoji HARADA ◽  
Nao-Aki NODA ◽  
Osamu UEHARA ◽  
Mitsuyoshi NAGANO
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
Specimen Dimension

scholarly journals Tensile Strength Change of Silicon Nitride/Stainless Steel Joints during Neutron Irradiation

2005 ◽  
Vol 23 (1) ◽  
pp. 88-94
Author(s):  
Masako NAKAHASHI ◽  
Toshiaki ITO ◽  
Yasushi GOTO ◽  
Yuji YASUDA ◽  
Xia ZHU ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Stainless Steel ◽  
Silicon Nitride ◽  
Neutron Irradiation ◽  
Strength Change ◽  
Steel Joints

Dependence of high-temperature tensile strength on displacement rate for hot-pressed silicon nitride

1990 ◽  
Vol 25 (6) ◽  
pp. 2990-2996 ◽  
Author(s):  
Tatsuki Ohji ◽  
Yukihiko Yamauchi ◽  
Wataru Kanematsu ◽  
Shoji Ito
Keyword(s):  
Tensile Strength ◽  
High Temperature ◽  
Silicon Nitride ◽  
Displacement Rate ◽  
High Temperature Tensile

scholarly journals Development of Improved Processing and Evaluation of Silicon Nitride

1991 ◽  
Author(s):  
V. K. Pujari ◽  
K. E. Amin ◽  
P. H. Tewari
Keyword(s):  
Tensile Strength ◽  
Silicon Nitride ◽  
Injection Molding ◽  
Nondestructive Evaluation ◽  
High Reliability ◽  
Rupture Life ◽  
Heat Engine ◽  
Stress Rupture ◽  
Stress Rupture Life ◽  
Process Route

The goals of this program are to develop and demonstrate significant improvements in processing methods, process controls, and nondestructive evaluation (NDE) which can be commercially implemented to produce high-reliability silicon nitride components for advanced heat engine applications at temperatures to 1370°C. Achievement of this goal is being sought by • The use of silicon nitride - 4% yttria composition which is consolidated by glass encapsulated HIP’ping. • The generation of baseline tensile strength data from an initial process route involving injection molding. • Fabrication of tensile test bars by colloidal techniques, e.g. injection molding and colloidal consolidation. • Identification of (critical) flaw populations through NDE and fractographic analysis of tensile bars. • Correlation of measured tensile strength with flaw populations and process parameters. • Minimization of these flaws through innovative improvements in process methods and controls. The program goals are: • mean room temperature tensile strength of 900 MPa and Weibull modulus of 20; • mean 1370°C fast fracture tensile strength of 500 MPa; • mean 1230°C tensile stress rupture life of 100 hours at 350 MPa. This report describes the progress made to date in developing injection molding and colloidal consolidation processes for the net shape forming (NSF) of tensile bars, nondestructive evaluation of processed material, and tensile testing of net shape bars in green and densified states.

Tensile strength of zinc oxide films measured by a microbridge method

2003 ◽  
Vol 18 (10) ◽  
pp. 2464-2472 ◽  
Author(s):  
C. W. Ong ◽  
D. G. Zong ◽  
M. Aravind ◽  
C. L. Choy ◽  
D. R. Lu
Keyword(s):  
Residual Stress ◽  
Tensile Strength ◽  
Zinc Oxide ◽  
Elastic Modulus ◽  
Silicon Nitride ◽  
Nitride Layer ◽  
Zno Films ◽  
Zno Film ◽  
Zinc Oxide Films ◽  
Silicon Nitride Layer

Double-layered ZnO/silicon nitride microbridges were fabricated for microbridge tests. In a test, a load was applied to the center of the microbridge specimen by using a microwedge tip, where the displacement was recorded as a function of load until the specimen broke. The silicon nitride layer in the structure served to enhance the robustness of the specimen. By fitting the data to a theory, the elastic modulus, residual stress, and tensile strength of the ZnO film were found to be 137 ± 18 GPa, −0.041 ± 0.02 GPa, and 0.412 ± 0.05 GPa, respectively. The analysis required the elastic modulus, internal stress, and tensile strength of the silicon nitride layer. They were measured separately by microbridge tests on single-layered silicon nitride microbridges. The measured tensile strength of the ZnO films represents the maximum tolerable tensile stress that the films can sustain when they are used as the functional component in devices.

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