Microstructural evolution and mechanical properties of Sn‐58Bi solder alloys with different cooling

Author(s):  
Xiaoping Li ◽  
Jun Shen ◽  
Mengqi Gong ◽  
Hao Li ◽  
Dengjun Luo ◽  
...  
2020 ◽  
Vol 31 (24) ◽  
pp. 22926-22932
Author(s):  
Hong-Sub Joo ◽  
Choong-Jae Lee ◽  
Kyung Deuk Min ◽  
Byeong-Uk Hwang ◽  
Seung-Boo Jung

Author(s):  
Hyeongsub So ◽  
Sung-Jae Won ◽  
Jihoon Park ◽  
Soong Ju Oh ◽  
Leeseung Kang ◽  
...  

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