A recently developed transfer printing technique, laser-driven noncontact microtransfer printing, which involves laser-induced heating to initiate the separation at the interface between the elastomeric stamp (e.g., polydimethylsiloxane (PDMS)) and hard micro/nanomaterials (e.g., Si chip), is valuable to develop advanced engineering systems such as stretchable and curvilinear electronics. The previous thermomechanical model has identified the delamination mechanism successfully. However, that model is not valid for small-size Si chip because the size effect is ignored for simplification in the derivation of the crack tip energy release rate. This paper establishes an accurate interfacial fracture mechanics model accounting for the size effect of the Si chip. The analytical predictions agree well with finite element analysis. This accurate model may serve as the theoretical basis for system optimization, especially for determining the optimal condition in the laser-driven noncontact microtransfer printing.
Development of microforming process combined with thin film transfer printing
