Residual stress and thermal properties of rubber‐modified epoxy systems for semiconductor package

2021 ◽  
pp. 51786
Author(s):  
Chunyan Qu ◽  
Xiao Zhang ◽  
Dezhi Wang ◽  
Xupeng Fan ◽  
Hongfeng Li ◽  
...  
Polymers ◽  
2019 ◽  
Vol 11 (9) ◽  
pp. 1522
Author(s):  
Ming Zhang ◽  
Mingqing Chen ◽  
Zhongbin Ni

We synthesized PPG-terminated tetra-carbamates as a new toughening additive for epoxy thermosets through facile addition reaction of hexamethylene diisocyanate (HDI) with poly(tetra-methylene glycols) (PTMG) and poly(propylene glycols) (PPG). The effects of prepared tetra-carbamates on the rheological behavior of neat epoxy resin were studied along with the various cured properties of their modified epoxy systems. Four carbamate groups (–NHCOO–) endow the prepared additives not only with good intramolecular interactions, but also with optimal intermolecular interactions with epoxy polymers. This results in the suitable miscibility of the additives with the epoxy matrix for the formation of the typical biphasic structure of microparticles dispersed in the epoxy matrix via polymerization-induced microphase separation. The impact strength and critical stress concentration factor (KIC) of cured modified epoxy systems with the additives are significantly higher than those of unmodified epoxy systems, without sacrificing the processability (Tg) and flexural strength. The toughening mechanism is understood as a synergism combination among the phase separation mechanism, the in situ homogeneous toughening mechanism, and the particle cavitation mechanism.


2019 ◽  
Vol 225 ◽  
pp. 239-246 ◽  
Author(s):  
Ahmer Hussain Shah ◽  
Xiao Li ◽  
Xiaodong Xu ◽  
Abdul Qadeer Dayo ◽  
Wen-bin Liu ◽  
...  

2020 ◽  
Vol 9 (3) ◽  
pp. 3158-3167 ◽  
Author(s):  
Vivekanandhan Chinnasamy ◽  
Sampath Pavayee Subramani ◽  
Sathish Kumar Palaniappan ◽  
Bhuvaneshwaran Mylsamy ◽  
Karthik Aruchamy

2008 ◽  
Vol 109 (2) ◽  
pp. 1105-1113 ◽  
Author(s):  
Pinggui Liu ◽  
Lihua He ◽  
Jiangxuan Song ◽  
Xingquan Liang ◽  
Heyan Ding

2013 ◽  
Vol 401-403 ◽  
pp. 713-716
Author(s):  
Cheng Fang ◽  
Dong Bo Guan ◽  
Wei Guo Yao ◽  
Shou Jun Wang ◽  
Hui An

The epoxy resin was modified with the mixture of α,ω-dihydroxy poly-(3,3,3-trifluoropropyl) siloxane (PTFPMS), KH560 and stannous octoate. KH560 can react with PTFPMS and also epoxy resin curing agent. The two reactions were characterized by FI-IR. The modified epoxy resin was characterized by FI-IR. The result showed that fluorine-containing silicone had been successfully introduced into the epoxy system. The mechanical and thermal properties of the modified epoxy resin were analyzed. The results showed that with the increase of PTFPMS the impact strength of epoxy resin increased, hardness and bending strength correspondingly reduced, slight decrease in the glass transition temperature.


2002 ◽  
Vol 124 (2) ◽  
pp. 206-214 ◽  
Author(s):  
Deok-Bo Lee ◽  
Toru Ikeda ◽  
Noriyuki Miyazaki ◽  
Nak-Sam Choi

The fracture behavior of an interface crack tip has significant influence on the structural integrity of an adhesive joint. We investigate a damage zone and the deformation of rubber particles around a tip of an interface crack between rubber-modified epoxy resin and aluminum. They are compared with those around a crack tip in homogeneous rubber-modified epoxy resin. Cavitations in rubber particles are observed around a damaged crack tip in homogeneous resin but not around a damaged interface crack tip. Rubber particles around an interface crack tip are deformed ellipsoidally due to the residual stress even before being damaged, and interfaces between rubber particles and epoxy resin around an interface crack tip are debonded after being damaged.


1989 ◽  
Vol 24 (4) ◽  
pp. 269-278 ◽  
Author(s):  
P. Förster ◽  
K.R. Hauschildt ◽  
J. Huber ◽  
G. Piecha ◽  
D. Pohl ◽  
...  
Keyword(s):  

2012 ◽  
Author(s):  
G. Gkikas ◽  
Ch. Saganas ◽  
S. A. Grammatikos ◽  
Gh. M. Maistros ◽  
N.-M. Barkoula ◽  
...  

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