Residual stress and thermal properties of rubber‐modified epoxy systems for semiconductor package
2019 ◽
Vol 225
◽
pp. 239-246
◽
Keyword(s):
2020 ◽
Vol 9
(3)
◽
pp. 3158-3167
◽
2008 ◽
Vol 109
(2)
◽
pp. 1105-1113
◽
Keyword(s):
Studies on Mechanical and Thermal Properties of Epoxy Resin Modified by Fluorine-Containing Silicone
2013 ◽
Vol 401-403
◽
pp. 713-716
Keyword(s):
2013 ◽
Vol 26
(3)
◽
pp. 298-306
◽
Keyword(s):
2002 ◽
Vol 124
(2)
◽
pp. 206-214
◽
Keyword(s):
1989 ◽
Vol 24
(4)
◽
pp. 269-278
◽
2006 ◽
Vol 20
(6)
◽
pp. 491-502
◽